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PDF RF2860 Data sheet ( Hoja de datos )

Número de pieza RF2860
Descripción PCS CDMA LOW NOISE AMPLIFIER/MIXER BROADBAND DOWNCONVERTER
Fabricantes RF Micro Devices 
Logotipo RF Micro Devices Logotipo



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RF2860
0 PCS CDMA LOW NOISE AMPLIFIER/MIXER
BROADBAND DOWNCONVERTER
RoHS Compliant & Pb-Free Product
Typical Applications
• CDMA Korean PCS Systems
• CDMA US PCS Systems
• IMT-2000 and 2.4GHz Band Applications
• GPS Applications
• General Purpose Downconverter
• Commercial and Consumer Systems
Product Description
The RF2860 is a broadband receiver front-end designed
for CDMA PCS applications. The broadband design
makes it a great solution as well for GPS, IMT-2000 and
2.4GHz applications. It is designed to amplify and down-
convert RF signals, while providing 21.5dB of stepped
gain control range. Features include digital control of LNA
gain, TX buffer/enable, and power down mode. Another
feature of the chip is the ability to set the bias point and
RF performance of the LNA and mixer through the ISET1
and ISET2 resistors respectively. Noise figure, IIP3, and
gain are designed to exceed the IS-98 interim standard
requirement for CDMA PCS communications. The IC is
manufactured on an advanced Silicon Germanium
Bi-CMOS process and is in a 3mmx3mm, 16-pin, lead-
less chip carrier.
Optimum Technology Matching® Applied
Si BJT
GaAs HBT
GaAs MESFET
Si Bi-CMOS
InGaP/HBT
SiGe HBT
Si CMOS
9GaN HEMT
SiGe Bi-CMOS
16 15 14 13
LNA GAIN 1
12 LO IN
LNA IN 2
11 GND
GND 3
10 IF OUT-
LNA OUT 4
9 IF OUT+
5678
Functional Block Diagram
0.10 C A
-A-
3.00
2 PLCS
1.50 TYP
2 PLCS
0.10 C B
0.70
0.65
0.05 C
0.90
0.85
0.05
0.00
3.00
2 PLCS
0.10 C B
2 PLCS
0.10 C A
2.75 SQ
-B-
1.37 TYP
0.60
0.24
TYP
NOTES:
1. Shaded lead is pin 1.
2 Dimension applies to plated terminal: to be measured
between 0.20 mm and 0.25 mm from terminal end.
12°
MAX
Dimensions in mm.
SEATING
-C- PLANE
0.10 M C A B
0.30
0.18 2
PIN 1 ID
R.20
0.50
0.30
1.65
1.35
SQ.
0.50
Package Style: QFN, 16-Pin, 3x3
Features
• LNA Noise Figure=1.3dB (KPCS)
• Stepped LNA Gain Control
• Integrated TX LO Buffer Amplifier
• Adjustable IIP3 versus Current for both
LNA and Mixer Blocks
• All Pins ESD Protected
Ordering Information
RF2860
PCS CDMA Low Noise Amplifier/Mixer Broadband
Downconverter
RF2860PCBA-41XFully Assembled Evaluation Board
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A9 050902
8-383

1 page




RF2860 pdf
RF2860
Pin Function Type Description
1 LNA GAIN DI Logic input. High activates LNA. Low selects LNA bypass
mode.
Interface Schematic
LNA GAIN
2
LNA IN
AI US PCS LNA input.
KPCS LNA input.
GPS LNA input.
IMT-2000 LNA input.
3
GND
P Ground via within 0.2mm of pin required.
4 LNA OUT AO PCS LNA output. Simple external L-C components required
for matching and VCC supply.
5
ISET2
AI External resistor required to set the mixer operating current.
6
ISET1
AI External resistor required to set the LNA operating current.
7
MIX IN
AI KPCS mixer RF single-end input. Matched to 50Ω.
USPCS mixer RF single-end input. Matched to 50Ω.
GPS mixer RF single-end input. Matched to 50Ω.
IMT-2000 mixer RF single-end input. Matched to 50Ω.
LNA IN
VCC
LNA OUT
LNA EMITTER
MIX IN
8
RF VCC
P External capacitor and inductor placed close to package
required.
9
IF OUT+
AO IF output. Open collector.
IF+
IF-
10
IF OUT-
AO IF output. Open collector.
11 GND P Ground.
12 LO IN AI LO single-end input. Matched to 50Ω.
See pin 9.
LO IN
70 Ω
13 VCC P External bypass capacitor may be required.
14
LO OUT
AO LO output. Internal DC block. Drives 50Ω.
15 TX BUFF DI Logic input. High enables TX LO output buffer amplifiers.
ENAB
16 ENABLE DI Logic input. Low level powers down the IC.
TX BUFF
ENAB
ENABLE
Pkg
Base
GND
P Ground connection. The backside of the package should be
soldered to a top side ground pad which is connected to the
ground plane with multiple vias.
Legend:
DI=Digital Input from Baseband Chip
AI=Analog Input
AO=Analog Output
P=VCC or GND
Rev A9 050902
8-387

5 Page





RF2860 arduino
RF2860 Layout Requirements
RF2860
NOTES:
1. This component is not required on the evaluation board. It may be required on the phone board for optimum IIP3.
Component placeholder should be on phone board.
2. Ground for LNA emitter. For maximum gain, place ground via as close to pin 3 as possible.
3. This capacitor is required as part of the mixer input match.
4. This inductor/capacitor parallel combination is used for mixer/preamplifier interstage tuning. It must be placed
~1.6mm or closer to pin 8.
Rev A9 050902
8-393

11 Page







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