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PDF T496 Data sheet ( Hoja de datos )
| Número de pieza | T496 | |
| Descripción | SOLID TANTALUM CHIP CAPACITORS | |
| Fabricantes | Kemet Corporation | |
| Logotipo |  |
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SOLID TANTALUM CHIP CAPACITORS
T496 SERIES—Fail-Safe Fused
FEATURES
• Built-in fuse protects against damaging short
circuit failure mode
• Precision-molded, laser-marked case
• Symmetrical, compliant terminations
• Taped and reeled per EIA 481-1
• Case geometry and footprints equivalent to
Industrial Grade T491 Series. (Case sizes
B, C, D and X only)
• 100% Surge Current test on C, D, X sizes
• Patented fuse assembly
• Operating Temperature: -55˚C to +125˚C
• Fuse actuation, 25ЊC: within 1 second at fault
currents of 4 amps and higher.
• Continuous current capability: 0.75 amps
• Post-actuation resistance,
25ЊC: 10 megohms minimum
• Test tabs on the sides of the case bypass the
capacitor element to allow direct testing of the
fuse assembly.
• RoHS Compliant & Leadfree Terminations (See
www.kemet.com for lead transition)
OUTLINE DRAWINGS
CATHODE (-) END
VIEW
W
SIDE VIEW
B
ANODE (+) END
VIEW
BOTTOM VIEW
B
Test Tab
H 0.15(0.006) Max.
E
KT
P
X
SGS
R
Termination
cutout at
A
L
KEMETs
Option,
either end
DIMENSIONS — Millimeters (Inches)
F
CASE SIZE
KEMET EIA
B 3528-21
C 6032-28
±
±
10
D 7343-31
X 7343-43
(.287 ± .012) (.169 ±
H
K
± 0.20
± (.008)
±
(.1
± .012)
1.1
(.043)
1.4
(.055)
1.5
(.059)
2.3
(.091)
± 0.1
2.2
(.087)
2.2
(.087)
2.4
(.094)
2.4
(.094)
± 0.3
S
0.8
(.031)
1.3
(.051)
1.3
(.051)
1.3
(.051)
B ± 0.15
(Ref) ±
(.016)
0.5
(.020)
0.5
(.020)
0.5
(.020)
X
(Ref)
±
(.004
(.004 ±
Notes: 1. Metric dimensions govern.
2. (Ref) - Dimensions provided for reference only.
* Round glue pad: 2.9 ± 0.1mm (.114" ± .004") in diameter at KEMET’s option.
PR
T AG
E
(Ref)
(Ref) (Min) (Ref) (Ref)
1.0 2.1 1.8 2.2
(.083) (.071) (.087)
1.0 2.8
(.1 (.094)
1.0 3.5
(.138)
1.0
(.067)
(.005) (.150) (.138) (.138)
T496 Series – ORDERING INFORMATION
T 496 B 105 M 025 A S
Tantalum
Series
T496 - Precision Molded, Fail-safe
Case Size
B, C, D, X
Capacitance Picofarad Code
Lead Material
T - 100% Sn (Tin) Plated
H - Tin/Lead (SnPb - 5% Pb minimum)
**“SS”- =NoNtorteRcoemcommemndeenddefodr new designs
Failure Rate
A - Not Applicable
Voltage
First two digits represent significant figures.
Capacitance Tolerance
Third digit specifies number of zeros to follow.
M - ± 20%
P***Paa“rSrtt”nNTuemurmmbeinrbaeetxioranmEcpxolaed:meTs4pa9lr6eeB:c1oT0n54vM9e0r6t2iB5nAg1T0fr(5o1mM4 d90i0g2Si5tnsA/1-S0noP(b1sp4toacd1e0isg0)%i.tSsteine
fwninwoiswhs.kepesam. Oerte.dcseo)rms
for Pb Free transition.
including “S” suffix
termination codes do not quarantee Pb-free product.
K - ± 10%
*Pb-free supply is not guaranteed with
the ‘S’ termination code.
This termination code not available
TYPICAL FUSE ACTUATION PROFILE
effective 15 July 2007.
Current (Amps)
10
1
.0001
.001
.01
.1
1 10
Time (Seconds)
36 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
1 page  
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165Њ to 180Њ from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
Tape Size
8 mm
and
12 mm
Tape Size
8 mm
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
D0 E P0 P2 T Max
1.5
+0.10 -0.0
(0.059
+0.004, -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.600
(0.024)
Variable Dimensions — Millimeters (Inches)
Pitch
B1 Max. D1 Min.
Note 1 Note 2
F
P1 R Min.
Note 3
Single
(4 mm)
4.4
(0.173)
1.0 3.5 ±0.05
4.0 ±0.10 25.0
(0.039) (0.138 ±0.002) (0.157 ±0.004) (0.984)
T1 Max
0.100
(0.004)
T2 Max
2.5
W
8.0 ±0.30
A0B0K0
Note 4
(0.098) (.315 ±0.012)
12 mm
Double
(8 mm)
8.2
(0.323)
1.5 5.5 ±0.05
8.0 ±0.10 30.0 4.6 12.0 ±0.30
(0.059) (0.217 ±0.002) (0.315 ±0.004) (1.181) (0.181) (0.472 ±0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
94 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet T496.PDF ] | |
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