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PDF C08051Cxxxx Data sheet ( Hoja de datos )
| Número de pieza | C08051Cxxxx | |
| Descripción | CERAMIC CHIP CAPACITORS | |
| Fabricantes | Kemet Corporation | |
| Logotipo |  |
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CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
W
T
S
L
TIN PLATE
B
NICKEL PLATE
ELECTRODES CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
SEIZIAESCIZOEDE
METRIC
SM(IRZEeEfTCoRnOIlDyC)E
CODE
SIZE CODE
0402*
1005
00260013**
0166038
00480025**
01620036*
01820150**
12108612*
1210*
1825*
1812
2220
1825*
22222205
12000152
13620186
23021225
34251362
3225
4564
4532
45566540
55665604
2225
5664
L - LENGTH
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
W - WIDTH
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
T
THICKNESS
See page 78
for thickness
dimensions.
B - BANDWIDTH
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
or
Solder Wave +
or
Solder Reflow
Solder
Reflow
Solder Reflow
CAPACITOR ORDERING INFORMATION (Standard Chips - For
C 0805 C 103 K 5 R A C*
Military see page 87)
CERAMIC
END METALLIZATION
SIZE CODE
C-Standard (Tin-plated nickel barrier)
SPECIFICATION
C - Standard
FAILURE RATE LEVEL
CAPACITANCE CODE
A- Not Applicable
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF M – ±20%
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
F – ±1%
P – (GMV) – special order only
1 - 100V 3 - 25V
G – ±2%
Z – +80%, -20%
2 - 200V 4 - 16V
5 - 50V
8 - 10V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces) 7 - 4V
9 - 6.3V
72 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
1 page  
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
®
KEMET
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
178mm (7.00")
or
330mm (13.00")
8mm ±.30
(.315 ±.012")
or
12mm ±.30
(.472 ±.012")
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
pGlacGreirmdident
cPoulartycaerdment
CourtyardC
C
XX
Reflow Solder
Dimension Z G
0402
2.14 0.28
0603
2.78 0.68
0805
3.30 0.70
1206
4.50 1.50
1210
4.50 1.50
1812
5.90 2.30
1825
5.90 2.30
2220
7.00 3.30
2225
7.00 3.30
X Y(ref) C(ref)
0.74 0.93 1.21
1.08 1.05 1.73
1.60 1.30 2.00
2.00 1.50 3.00
2.90 1.50 3.00
3.70 1.80 4.10
6.90 1.80 4.10
5.50 1.85 5.15
6.80 1.85 5.15
Z
3.18
3.70
4.90
4.90
Wave Solder
G X Y(ref)
Not Recommended
0.68 0.80
0.70 1.10
1.50 1.40
1.50 2.00
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
Not Recommended
Calculation Formula
GG Y
Z = Lmin + 2Jt + Tt
Y ZZ
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
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