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PDF 33997 Data sheet ( Hoja de datos )
| Número de pieza | 33997 | |
| Descripción | Switching Power Supply | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de 33997 (archivo pdf) en la parte inferior de esta página. Total 20 Páginas | ||
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MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Document order number: MC33997/D
Rev 3.0, 03/2003
Advance Information
Switching Power Supply with Linear
Regulators
The 33997 is a medium-power, multi-output power supply integrated circuit
that is capable of operating over a wide input voltage range, from 6.0 V up to
26.5 V with 40 V transient capability. It incorporates a sensorless current
mode control step-down switching controller regulating directly to 5.0 V. The
3.3 V linear regulator uses an external pass transistor to reduce the 33997
power dissipation. The 33997 also provides a 3.3 V linear standby regulator
and two 5.0 V sensor supply outputs protected by internal low-resistance
LDMOS transistors.
There are two separate enable pins for the main and sensor supply outputs
and standard supervisory functions such as resets with power-up reset delay.
The 33997 provides proper power supply sequencing for advanced
microprocessor architectures such as the Motorola MPC5xx and 683xx
microprocessor families.
Features
• Operating Voltage Range 6.0 V up to 26.5 V (40 V transient)
• Step-Down Switching Regulator Output VDDH = 5.0 V @ 1400 mA (total)
• Linear Regulator with External Pass Transistor VDDL = 3.3 V @ 400 mA
• Low-Power Standby Linear Regulator VKAM = 3.3 V @ 10 mA
• Two 5.0 V @ 200 mA (typical) Sensor Supplies VREF Protected Against
Short-to-Battery and Short-to-Ground with Retry Capability
• Undervoltage Shutdown on the VDDL, VDDH Outputs with Retry Capability
• Reset Signals
• Power-Up Delay
• Enable Pins for Main Supplies (EN) and Sensor Supplies (SNSEN)
• Power Sequencing for Advanced Microprocessor Architectures
• SOIC-24WB Package
33997
POWER SUPPLY
INTEGRATED CIRCUIT
DW SUFFIX
24-LEAD SOICW
CASE 751E
ORDERING INFORMATION
Device
Temperature
Range (TA)
Package
MC33997DW/R2 -40°C to 125°C
24 SOICW
33997 Simplified Application Diagram
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Motorola, Inc. 2003
For More Information On This Product,
Go to: www.freescale.com
1 page  
Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Main Supply Voltage
VPWR
-0.3 to 45
V
Keep-Alive Supply Voltage
KA_VPWR
-0.3 to 45
V
Switching Node
VSW
-0.5 to 45
V
5.0 V Input Power
VDDH
-0.3 to 6.0
V
Sensor Supply
VREF1
VREF2
-0.3 to 18
-0.3 to 18
V
Keep-Alive Supply Voltage
VKAM
-0.3 to 6.0
V
Maximum Voltage at Logic I/O Pins
EN
SNSEN
PWROK
VKAMOK
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
V
Charge Pump Reservoir Capacitor Voltage
CRES
-0.3 to 18
V
Error Amplifier Summing Node
VSUM
-0.3 to 6.0
V
Switching Regulator Output Feedback
FBKB
-0.3 to 6.0
V
VDDL Base Drive
DRVL
-0.3 to 6.0
V
VDDL Feedback
FBL
-0.3 to 6.0
V
ESD Voltage
Human Body Model (all pins) (Note 1)
Machine Model (all pins) (Note 2)
VESD1
VESD2
±500
±100
V
Power Dissipation (TA = 25°C) (Note 3)
PD 800 mW
Thermal Resistance, Junction to Ambient (Note 4), (Note 5)
RθJ-A
60 °C/W
Thermal Resistance, Junction to Board (Note 6)
RθJ-B
20 °C/W
Operational Package Temperature [Ambient Temperature] (Note 7)
TA
-40 to 125
°C
Operational Junction Temperature
TJ
-40 to 150
°C
Storage Temperature
TSTG
-55 to 150
°C
Lead Soldering Temperature (Note 8)
TS 260 °C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω).
2. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω)
3. Maximum power dissipation at indicated junction temperature.
4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
5. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
8. Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
MOTOROLA ANALOG INTEGRATED CIRFCoUIrTMDEoVrICeEIDnAfoTArmation On This Product,
Go to: www.freescale.com
33997
5
5 Page 
Freescale Semiconductor, Inc.
6.0
0
5.0
2.5V
0
5.0
Timing Diagrams
tSS
4.8V
0
TIME
Figure 2. Soft-Start Time
14
0
5.0
0 tDet
5.0 4.0?V?V
2.0V
0
tRet
2.0V
3.3
0
TIME
Figure 3. VREF Retry Timer
14
0
5.0
0
5.0
4.6V
0 tD(PWROK)
3.3
0
T IM E
Figure 4. PWROK Delay Timer (Power-On Reset)
MOTOROLA ANALOG INTEGRATED CIRFCoUIrTMDEoVrICeEIDnAfoTArmation On This Product,
Go to: www.freescale.com
33997
11
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet 33997.PDF ] | |
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