BD3940FP Datasheet PDF - ROHM Semiconductor
| Part Number | BD3940FP | |
| Description | LDO Regulator | |
| Manufacturers | ROHM Semiconductor | |
| Logo |  |
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TECHNICAL NOTE
Power Management LSI Series for Automotive Body Control
High temperature
operating
LDO Regulator
Now available
BD3940FP, BD3941FP/HFP/T
zDescription
BD394□FP Series regulators feature a high 36 V breakdown voltage and are compatible with onboard vehicle microcontrollers. They offer
an output current of 500 mA while limiting dark current to 30 µA (TYP). The series supports the use of ceramic capacitors as output phase
compensation capacitors. Since the ICs use P-channel DMOS output transistors, increased loads do not result in increased total supply
current. BD394□FP Series is ideal for lowering current consumption and costs in battery direct-coupled systems.
zFeatures
1) Super-low dark current: 30 µA (Typ.)
2) Low-saturation voltage type P-channel DMOS output transistors
Output on resistance: 1.6 Ω (Typ.)
3) High precision output voltage: 5 V ±2% (Ta = 25°C) / Iomax = 500 mA
4) Low-ESR ceramic capacitors can be used as output capacitors
5) Vcc power supply voltage = 36 V / Peak power supply voltage = 50 V (tr ≥ 1 ms, tH ≤ 200 ms)
6) Built-in over current protection circuit and thermal shutdown circuit
7) TO252-3/HRP-5/TO220FP-3 package
zApplications
Vehicle equipment, car stereos, satellite navigation systems, etc.
zProduct line
Model
Output voltage
BD3940FP
3.3 V
BD3941FP/HFP/T
5.0 V
zAbsolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Limit
Unit
Power supply voltage
Vcc
36*1
V
Output current
Io 500 mA
1.2*2
Power dissipation
Pd
1.6*3
W
2.0*4
Operating temperature range
Topr
−40 to +125
°C
Storage temperature range
Tstg
−55 to +150
°C
Peak power supply voltage
Vcc Peak
50*5
V
Maximum junction temperature
Tjmax
150 °C
* 1Not to exceed Pd.
*2 For TO252-3, reduced by 9.6 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*3 Reduced by 12.8 mW/°C over 25°C, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
*4 For TO220FP-3, reduced by 16.0 mW/°C over 25°C.
*5 Application time 200 ms or shorter. (tr ≥ 1 ms)
Ver.B Oct2005
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zThermal design
TO252-3
HRP5
TO220FP-3
2.0
1.6
1.2W
1.2
0.8
IC mounted on a ROHM standard board
Board size: 70 mm ×70 mm × 1.6mm
θja = 104.2 (°C /W)
2.0
1.6W
1.6
1.2
0.8
IC mounted on a ROHM standard board
Board size: 70 mm ×70 mm × 1.6mm
θja = 78.1 (°C /W)
0.4
0
0
25 50 75 100 125 150
AMBIENT TEMPERATURE: Ta [℃]
Fig.19
0.4
0
0
25 50 75 100 125 150
AMBIENT TEMPERATURE: Ta [℃]
Fig.20
25
(1)20W
20
(1)無限大放熱板使用時 θja=6.25( /W)
(2)IC 単体時 θja=62.5(℃/W)
15
10
5
(2)2.0W
0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE: Ta [℃]
Fig.21
Refer to the dissipation reduction illustrated in Figs. 19 to 21 when using the IC in an environment where Ta ≥ 25°C. The characteristics of the IC
are greatly influenced by the operating temperature. If the temperature exceeds the maximum junction temperature Tjmax, the elements of the IC
may be damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from
instantaneous damage and the maintenance of the reliability of the IC in long-time operation.
In order to protect the IC from thermal destruction, the operating temperature of the IC must not exceed the maximum junction temperature Tjmax.
Fig. 19 illustrates the power dissipation/power reduction for the TO252 package. Operate the IC within the power dissipation Pd. The following
method is used to calculate the power consumption Pc (W).
Pc = (Vcc − Vo) × Io + Vcc × Icc
Vcc:
Power dissipation Pd ≤ Pc
Vo:
Io:
Icc:
The load current Io is obtained to operate the IC within the power dissipation.
Input voltage
Output voltage
Load current
Total supply current
Pd − Vcc × Icc
Io ≤
Vcc − Vo
(Refer to Icc in Fig.12)
The maximum load current Iomax for the applied voltage Vcc can be calculated during the thermal design process.
Calculation example
Example) Vcc = 12 V and Vo = 5.0 V at Ta = 85°C, BD3941FP
Io ≤ 0.624 −12 × Icc
12 − 5
θja = 104.2°C/W → −9.6 mAW/°C
25°C = 1.2 W → 85°C = 0.624 W
Io ≤ 89 mA (Icc = 30 µA)
Make a thermal calculation in consideration of the above equations so that the whole operating temperature range will be within the power
dissipation. The power consumption Pc of the IC, in the event of shorting (i.e., if the Vo and GND pins are shorted), will be obtained from the
following equation:
Pc = Vcc × (Icc + Ishort)
Ishort: Short current
zExternal settings for pins and precautions
1) Vcc pin
Insert capacitors with a capacitance of 0.33 µF to 1,000 µF between the Vcc and GND pins.
The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin.
2) Capacitors for stopping oscillation at output pins
Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a capacitance range
between 1 µF and 1,000 µF. A ceramic capacitor with low ESR values, from 0.001 Ω to 100, can be used. Unstable input voltage and load
fluctuations can affect output voltages. Output capacitor capacitance values should be determined for actual application.
5/8
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for BD3940FP electronic component. |
| Information | Total 9 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ BD3940FP.PDF Datasheet ] | |
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