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PDF MASWGM0005-DIE Data sheet ( Hoja de datos )
| Número de pieza | MASWGM0005-DIE | |
| Descripción | Switch | |
| Fabricantes | Tyco Electronics | |
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Switch, Single-Pole, Double-Throw
DC-5.0 GHz
Features
♦ DC-5.0 GHz Operation
♦ 1 dB Insertion Loss
♦ 55 dB Isolation
♦ Class I ESD
♦ TTL Control
♦ Excellent Match on Off Port
♦ MSAG™ Process
MASWGM0005-DIE
903219 —
Preliminary Information
Description
The MASWGM0005-Die is a single pole double throw switch that
is fully matched to 50 ohms on both the input and output.
Fabricated using M/A-COM’s repeatable, high performance and
highly reliable GaAs Multifunction Self-Aligned Gate MESFET
Process, each device is 100% RF tested on wafer to ensure
performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like manu-
facturing processes, planar processing of ion implanted transis-
tors, multiple implant capability enabling power, low-noise,
switch and digital FETs on a single chip, and polyimide scratch
protection for ease of use with automated manufacturing proc-
esses. The use of refractory metals and the absence of platinum
in the gate metal formulation prevents hydrogen poisoning when
employed in hermetic packaging.
Primary Applications
♦ Telecom Infrastructure
♦ Military Radios, Radar
♦ Space Systems
♦ Test instrumentation
Electrical Characteristics: TB = 25°C1, Z0 = 50Ω, VEE = -5V
Parameter
Symbol
Typical
Units
Bandwidth
f
DC-5.0
GHz
Insertion Loss @ 1 GHz
IL 0.8 dB
Insertion Loss @ 5 GHz
IL 1.6 dB
Isolation @ 1 GHz
ISO 57 dB
Isolation @ 5 GHz
ISO 58 dB
Out1-Out2 Isolation
ISO 59 dB
Input VSWR (On)
VSWR
1.3:1
Output VSWR (On)
VSWR
1.3:1
Output VSWR (Off)
VSWR
1.3:1
Input Third Order Intercept
ITOI
Under Test
dBm
Input 1-dB Compression Point
P1dB
Under Test
dBm
Video Leakage
Under Test
dB
ESD Capability, HBM, No Damage
300 V
1. TB = MMIC Base Temperature
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1 page  
Switch, Single-Pole, Double-Throw
DC-5.0 GHz
Assembly and Bonding Diagram
MASWGM0005-DIE
903219 —
Preliminary Information
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Fol-
low the manufacturer’s instructions. If solder is employed , use AuSn (80/20) 1-2 mil preform solder.
Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially
above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over
ball bonds.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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