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Número de pieza | MASWGM0002-DIE | |
Descripción | Switch | |
Fabricantes | Tyco Electronics | |
Logotipo | ||
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Switch, Single-Pole, Double-Throw
2.0-20.0 GHz
Features
♦ 2.0-20.0 GHz Operation
♦ 3 dB Insertion Loss
♦ TTL Control
♦ Excellent Match on Off Port
♦ MSAG™ Process
MASWGM0002-DIE
903230 —
Preliminary Information
Description
The MASWGM0002-Die is a single pole double throw switch
that is fully matched to 50 ohms on both the input and output.
Fabricated using M/A-COM’s repeatable, high performance
and highly reliable GaAs Multifunction Self-Aligned Gate
(MSAG™) Process, each device is 100% RF tested on wafer
to ensure performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like
manufacturing processes, planar processing of ion implanted
transistors, multiple implant capability enabling power, low-
noise, switch and digital FETs on a single chip, and polyimide
scratch protection for ease of use with automated manufactur-
ing processes. The use of refractory metals and the absence
of platinum in the gate metal formulation prevents hydrogen
poisoning when employed in hermetic packaging.
Primary Applications
♦ Test Equipment and Instrumentation
♦ Electronic Warfare
♦ Weather and Military Radar
♦ Point to Point Communications
♦ VSAT
Electrical Characteristics: TB = 25°C1, Z0 = 50Ω, VEE = -5V
Parameter
Symbol
Typical
Bandwidth
f 2.0-20.0
Insertion Loss @ 10 GHz
IL 3
Insertion Loss @ 20 GHz
IL 4.3
Isolation @ 10 GHz
ISO 50
Isolation @ 20 GHz
ISO 35
Input VSWR (On)
VSWR
1.4:1
Output VSWR (On)
VSWR
1.4:1
Output VSWR (Off)
VSWR
1.2:1
Input Third Order Intercept
ITOI 29
Input 1-dB Compression Point
P1dB
26
Units
GHz
dB
dB
dB
dB
dBm
dBm
1. TB = MMIC Base Temperature
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1 page Switch, Single-Pole, Double-Throw
2.0-20.0 GHz
Assembly and Bonding Diagram
VEE
0.1 μF
100 pF
OUT
1
VEE A
GND:G
GND:G
GND:G
GND:G
W = 12
S=8
Len = 432
r = i25
GND:G
GND:G
GND:G
GND:G
Lr e=ni1=8320
S=8
W=8
OUT
2
GND:G
COM
MASWGM0002-DIE
903230 —
Preliminary Information
TTL
Figure 4. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Fol-
low the manufacturer’s instructions. If solder is employed , use AuSn (80/20) 1 mil preform solder.
Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially
above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over
ball bonds.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
5 Page |
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Número de pieza | Descripción | Fabricantes |
MASWGM0002-DIE | Switch | Tyco Electronics |
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