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PDF AG303-63 Data sheet ( Hoja de datos )
| Número de pieza | AG303-63 | |
| Descripción | InGaP HBT Gain Block | |
| Fabricantes | WJ Communication | |
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AG303-63www.DataSheet4U.com
InGaP HBT Gain Block
The Communications Edge TM
Product Information
Product Features
• DC – 6000 MHz
• +14 dBm P1dB at 900 MHz
• +26 dBm OIP3 at 900 MHz
• 20.5 dB Gain at 900 MHz
• Single Voltage Supply
• Lead-free / RoHS-compliant /
Green SOT-363 package
• Internally matched to 50 Ω
Applications
• Mobile Infrastructure
• CATV / FTTX
• W-LAN / ISM
• RFID
• WiMAX / WiBro
Product Description
Functional Diagram
The AG303-63 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG303-63 typically provides
20.5 dB gain, +26 dBm OIP3, and +14 dBm P1dB. The
device combines dependable performance with consistent
quality to maintain MTTF values exceeding 1000 years at
mounting temperatures of +85 °C and is housed in a lead-
free/green/RoHS-compliant SOT-363 industry standard
SMT package.
The AG303-63 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation.
GND 1
6 RF OUT
GND 2
5 GND
RF IN 3
4 GND
Function
Input
Output/Bias
Ground
Pin No.
3
6
1, 2, 4, 5
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG303-63 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and WiMAX.
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Output IP2
Noise Figure
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Device Voltage
Device Current
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
Min
DC
17.3
Typ
900
20.5
21
24
+14
+25.8
+34
3.2
1900
18.3
+12.6
+25.3
4.23
35
Max
6000
19.3
1. Test conditions:. T = 25 ºC, Supply Voltage = +5 V, Rbias = 22.1 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of -2 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Typical Performance (1)
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
21.1
-20
-25
+14.0
+26.1
3.1
Typical
900 1900
20.5 18.3
-21 -20
-24 -19
+14.0 +12.6
+25.8 +25.3
3.2 3.4
2140
17.7
-20
-18
+12.2
+24.9
3.4
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 °C
-55 to +125 °C
+4.5 V
+10 dBm
+250 °C
Ordering Information
Part No.
AG303-63G
AG303-63PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 Package)
700 – 2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
Page 1 of 5 April 2006
1 page  
AG303-63www.DataSheet4U.com
InGaP HBT Gain Block
The Communications Edge TM
Product Information
AG303-63G (Green / Lead-free SOT-363 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
Outline Drawing
Product Marking
The component will be marked with a “J”
designator followed by a two-digit numeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E” designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1C
Value:
Passes ≥ 1000V min.
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes ≥ 1000V min.
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
Thermal Specifications
Parameter
Operating Case Temperature
Rating
-40 to +85 °C
10000
1000
MTTFvs. GNDLeadTemperature
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
350 °C / W
137 °C
100
10
1. The thermal resistance is referenced from the hottest
part of the junction to the ground pin (pin 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85 °C case temperature. A
minimum MTTF of 1 million hours is achieved for
1
60 70 80 90 100 110 120
Ground Lead Temperature (°C)
junction temperatures below 177 °C.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
Page 5 of 5 February 2005
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