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PDF MADS-001317-1320AG Data sheet ( Hoja de datos )
| Número de pieza | MADS-001317-1320AG | |
| Descripción | GaAs Solder Bump Flip Chip Schottky Diode | |
| Fabricantes | Tyco Electronics | |
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MADS-001317-1320AG
GaAs Solder Bump Flip Chip Schottky Diode
Features
• Low Series Resistance, 4 Ω
• Low Capacitance, 45 fF
• High Cutoff Frequency
• Silicon Nitride Passivation
• Polyimide Scratch Protection
• Solderable Bump Die Attach
Description
M/A-COM’s MADS-001317-1320AG is a Gallium
Arsenide Flip-Chip Schottky diode with solder
bumps. These devices are fabricated on OMCVD
epitaxial wafers using a process designed for high
device uniformity and extremely low parasitics.
This device can be used up to 80 GHz. This diode
is fully passivated with silicon nitride and has an
additional layer of a polymer for scratch protection.
The protective coatings prevent damage to the
junction during handling and circuit attachment.
Applications
The high cutoff frequency of this device allows use
through millimeter wave frequencies. Typical Ap-
plications include single and double balanced mix-
ers in PCN transceivers, radios, police radar detec-
tors and automotive radar detectors.
Electrical Specifications TA = 25°C
Parameters and Test Conditions
Symbol
Junction Capacitance at 0V at 1 MHz
Cj
Total Capacitance at 0V at 1 MHz1
Ct
M/A-COM Products
Rev. V2
Mounting Side with Solder Bumps
Units
pF
pF
Min.
—
.030
Typ.
0.020
0.045
Max.
—
0.060
Forward Voltage at 1mA
Vf
Volts
.60
Dynamic Resistance at 9.5 - 10.5 mA
Rd
Ohms
—
Reverse Breakdown Voltage at 10 µA
Vb
Volts
4.5
1. Total Capacitance is equivalent to the sum of junction capacitance (Cj) and parasitic capacitance (Cp).
.70
4
7
.80
7
—
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
• North America Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
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| Páginas | Total 3 Páginas | |
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Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MADS-001317-1320AG | GaAs Solder Bump Flip Chip Schottky Diode | Tyco Electronics |
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