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PDF MAAPGM0053-DIE Data sheet ( Hoja de datos )
| Número de pieza | MAAPGM0053-DIE | |
| Descripción | Amplifier | |
| Fabricantes | Tyco Electronics | |
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Amplifier, Distributed Power, 0.5 W
2.0-18.0 GHz
Features
♦ 0.5 Watt Saturated Output Power Level
♦ Variable Drain Voltage (5-10V) Operation
♦ MSAG™ Process
♦ Proven Manufacturability and Reliability
No Airbridges
Polyimide Scratch Protection
No Hydrogen Poisoning Susceptibility
MAAPGM0053-DIE
903217 —
Preliminary Information
Description
The MAAPGM0053-Die is a single stage power amplifier with on-
chip bias networks. This product is fully matched to 50 ohms on
both the input and output. It can be used as a power amplifier stage
or as a driver stage in high power applications.
Fabricated using M/A-COM’s repeatable, high performance and
highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™)
Process, each device is 100% RF tested on wafer to ensure
performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like manufac-
turing processes, planar processing of ion implanted transistors,
multiple implant capability enabling power, low-noise, switch and
digital FETs on a single chip, and polyimide scratch protection for
ease of use with automated manufacturing processes. The use of
refractory metals and the absence of platinum in the gate metal for-
mulation prevents hydrogen poisoning when employed in hermetic
packaging.
Primary Applications
♦ Test Equipment
♦ Electronic Warfare
♦ Radar
Electrical Characteristics: TB = 40°C1, Z0 = 50Ω, VDD = 8V, IDQ ≈ 250 mA2, Pin = 22 dBm
Parameter
Symbol
Typical
Units
Bandwidth
f
2.0-18.0
GHz
Output Power
1 dB Compression Point
POUT
P1dB
27.0
26
dBm
dB
Small Signal Gain
G
6
dB
Input VSWR
VSWR
1.5:1
Output VSWR
VSWR
1.5:1
Gate Supply Current
IGG
3
mA
Drain Supply Current
IDD
400
mA
Noise Figure
NF
7
dB
1. TB = MMIC Base Temperature
2. Adjust VGG between –2.4 and –1.5V to achieve IDQ indicated.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
• North America Tel: 800.366.2266 / Fax: 978.366.2266
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
whatsoever arising out of the use or application of any product(s) or
information.
Visit www.macom.com for additional data sheets and product information.
1 page  
Amplifier, Distributed Power, 0.5 W
2.0-18.0 GHz
Assembly and Bonding Diagram
VDD
0.1 μF
100 pF
MAAPGM0053-DIE
903217 —
Preliminary Information
RFIN
G ND:G
G ND:G
GND:G
IN
GND:G
VD
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
G ND:G
GND:D
GND:G
OUT
GND:G
G ND:G
G ND:G
RFOUT
VG GND:D
100 pF
0.1 μF
VGG
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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