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What is MAAPGM0038-DIE?

This electronic component, produced by the manufacturer "Tyco Electronics", performs the same function as "C/Ku-Band Power Amplifier".


MAAPGM0038-DIE Datasheet PDF - Tyco Electronics

Part Number MAAPGM0038-DIE
Description C/Ku-Band Power Amplifier
Manufacturers Tyco Electronics 
Logo Tyco Electronics Logo 


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RO-P-DS-3022 - -
1.2Wwww.DataSheet4U.com C/Ku-Band Power Amplifier
7.5-13.5 GHz
Preliminary Information
Features
7.5-13.5 GHz Operation
1.2 Watt Saturated Output Power Level
Variable Drain Voltage (4-10V) Operation
Self-Aligned MSAG® MESFET Process
Primary Applications
Point-to-Point
Weather Radar
Airborne Radar
Description
The MAAPGM0038-Die is a 3-stage 1.2 W power ampli-
fier with on-chip bias networks. This product is fully
matched to 50 ohms on both the input and output. It can
be used as a power amplifier stage or as a driver stage in
high power applications.
Each device is 100% RF tested on wafer to ensure
performance compliance. The part is fabricated using M/
A-COM’s repeatable, high performance and highly reli-
able GaAs Multifunction Self-Aligned Gate (MSAG®)
MESFET Process. This process features silicon nitride
passivation and polyimide scratch protection.
7.5-13.5 GHz GaAs MMIC Amplifier
Electrical Characteristics: TB = 40°C1, Z0 = 50 , VDD = 8V, VGG = -2V, Pin = 20 dBm
Parameter
Symbol
Typical
Units
Bandwidth
f
7.5-13.5
GHz
Output Power
POUT
31
dBm
Power Added Efficiency
PAE
21
%
1-dB Compression Point
P1dB
29
dBm
Small Signal Gain
G
19 dB
Input VSWR
VSWR
4:1
Gate Current
IGG
< 12
mA
Drain Current
IDD
< 1.1
A
Output Third Order Intercept
OTOI
40
dBm
Noise Figure
NF
8
dB
2nd Harmonic
3rd Harmonic
2f
3f
-17 dBc
-34 dBc
1. TB = MMIC Base Temperature

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MAAPGM0038-DIE equivalent
1.2W C/Ku-Band Power Amplifier
RO-P-DS-3022 - - 5/6
MAAPGM0038-DIE
Mechanical Information
Chip Size: 2.980 x 2.980 x 0.075 mm (117 x 117 x 3 mils)
2.980mm.
2.828mm.
2.828mm.
1.490mm.
1.490mm.
0.152mm.
0
0
0.152mm.
Figure 5. Die Layout
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Pad
RF In and Out
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
Size (µm)
100 x 200
200 x 150
150 x 150
Size (mils)
4x8
8x6
6x6
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
„ North America: Tel. (800) 366-2266
„ Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
„ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product informVat1io.0n0.


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On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for MAAPGM0038-DIE electronic component.


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Featured Datasheets

Part NumberDescriptionMFRS
MAAPGM0038-DIEThe function is C/Ku-Band Power Amplifier. Tyco ElectronicsTyco Electronics

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