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Número de pieza | MAAPGM0016-DIE | |
Descripción | 5W Ku-Band Power Amplifier | |
Fabricantes | Tyco Electronics | |
Logotipo | ||
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5W Ku-Band Power Amplifier
12.0-15.0 GHz
Features
♦ 12.0-15.0 GHz Operation
♦ 5 Watt Saturated Output Power Level
♦ Variable Drain Voltage (4-10V) Operation
♦ Self-Aligned MSAG® MESFET Process
Description
The MAAPGM0016-DIE is a 3-stage 5 W power amplifier with on-chip bias
networks. This product is fully matched to 50 ohms on both the input and
output. It can be used as a power amplifier stage or as a driver stage in
high power applications.
Fabricated using M/A-COM’s repeatable, high performance and highly reli-
able GaAs Multifunction Self-Aligned Gate (MSAG™) Process, each device
is 100% RF tested on wafer to ensure performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like manufacturing
processes, planar processing of ion implanted transistors, multiple implant
capability enabling power, low-noise, switch and digital FETs on a single
chip, and polyimide scratch protection for ease of use with automated
manufacturing processes. The use of refractory metals and the absence of
platinum in the gate metal formulation prevents hydrogen poisoning when
employed in hermetic packaging.
MAAPGM0016-DIE
Rev A
Preliminary Datasheet
Primary Applications
♦ Point-to-Point Radio
♦ SatCom
♦ DBS
Electrical Characteristics: TB = 40°C1, Z0 = 50 Ω, VDD = 8V, IDQ = 2.4 A2, Pin = 21 dBm, RG=25 Ω
Parameter
Bandwidth
Output Power
Power Added Efficiency
1-dB Compression Point
Small Signal Gain
Input VSWR
Gate Current
Drain Current
2nd Harmonic
3rd Harmonic
Symbol
f
POUT
PAE
P1dB
Gn
VSWR
IGG
IDD
2f
3f
Typical
12.0-15.0
37
24
36
20
3:1
<2
<3.5
-40
-75
Units
GHz
dBm
%
dBm
dB
mA
A
dBc
dBc
1. TB = MMIC Base Temperature
2. Adjust VGG between –2.5 and –1.2V to achieve specified Idq.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1 page 5W Ku-Band Power Amplifier
12.0-15.0 GHz
Assembly and Bonding Diagram
0.1 μF
0.1 μF
100 pF
100 pF
MAAPGM0016-DIE
Rev A
Preliminary Datasheet
0.1 μF
VDD
100 pF
RF IN
R FO UT
VGG
25 Ω
100 pF
100 pF
0.1 μF
0.1 μ F
100 pF
0.1 μF
V DD
Figure 6. Die Layout
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet MAAPGM0016-DIE.PDF ] |
Número de pieza | Descripción | Fabricantes |
MAAPGM0016-DIE | 5W Ku-Band Power Amplifier | Tyco Electronics |
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