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PDF MA4SW510B-1 Data sheet ( Hoja de datos )
| Número de pieza | MA4SW510B-1 | |
| Descripción | SP5T PIN Diode Switch | |
| Fabricantes | Tyco Electronics | |
| Logotipo |  |
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SP5Twww.DataSheet4U.com PIN Diode Switch with
Integrated Bias Network
V 1.00
Features
n Ultra Broad Bandwidth: 2 GHz to 18 GHz
n 1.8 dB Insertion Loss, 35 dB Isolation at 18 GHz
n Reliable. Fully Monolithic, Glass Encapsulated
Construction
MA4SW510B-1 Layout
Description
The MA4SW510B-1 is a SP5T Series-Shunt broad band switch
with integrated bias networks made with M/A-COM’s HMICTM
(Heterolithic Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation of silicon
pedestals that form series and shunt diodes or vias by imbedding
them in low loss glass. By using small spacing between elements,
this combination of silicon and glass gives HMIC devices low loss
and high isolation performance through 18 GHz.
Applications
These high performance switches are suitable for the use in multi-
band ECM, Radar, and instrumentation control circuits where high
isolation to insertion loss ratios are required. With a standard
+5 V/-5 V, TTL controlled PIN diode driver, 80 ns switching
speeds are achieved.
Absolute Maximum Ratings1
@ TA = +25 °C (unless otherwise
specified)
Parameter
Operating Temperature
Storage Temperature
RF C.W. Incident Power
(+/-20 mA)
DC Bias Current (Forward)
Applied Voltage (Reverse)
Value
-65 °C to +125 °C
-65 °C to +150 °C
+ 30 dBm
+/- 40 mA
15 V
1. Exceeding any of these values may result in permanent
damage
Nominal Chip Dimensions
Chip
RF
DC
J1
J2
B2
J3
B3
J4
B4
J5
B5
J6
B6
Chip Dimensions (µm)
XY
3120
3120
Pad Dimensions (µm)
X
Y
400 175
125 125
Pad Locations (µm)
X
Y
00
-1385
+500
-2285
+1200
-1385
+2000
-1385
+2700
0 +2770
+700
+2770
+1385
+2000
+1385
+1300
+1385
+500
+900
0
Pad Locations Relative to J1
1 page  
SP5T PIN Diode Switch with Integrated Bias Network
MA4SW510B-1
Assembly Considerations
The following precautions should be observed for successful
assembly of the die.
Cleanliness
These chips should be handled in a clean environment. Do not
attempt to clean die after installation.
Electro-Static Sensitivity
The MA4SW Series PIN switches are ESD, Class 1 sensitive.
The proper ESD handling procedures should be used.
V 1.00
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended
with a work surface temperature of 255 oC and a tool tip
temperature of 265 oC. When hot gas is applied, the tool tip
temperature should be 290 oC. The chip should not be exposed
to temperatures greater than 320 oC for more than 10 seconds.
No more than three seconds should be required for the attachment.
Epoxy Die Attachment
Assembly should be preheated to 125-150 oC. A Controlled
thickness of 2 mils is recommended for best electrical and
thermal conductivity. A thin epoxy fillet should be visible
around the perimeter of the chip after placement. Cure epoxy
per manufacturer’s recommended schedule.
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025”
ribbon or 0.001” diameter gold wire is recommended. A stage
temperature of 150 oC and a force of 18 to 22 grams should be
used. Ultrasonic energy should be adjusted to the minimum
required. RF bonds should be as short as possible to minimize
inductance.
Mounting
These chips have Ti-Pt-Au back metal. They can be die
mounted with a 80Au/20Sn or Sn62/Pb36/Ag2 solder preform
or electrically conductive Ag epoxy. Mounting surface must
be clean of oils and contaminants and flat.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
5
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MA4SW510B-1.PDF ] | |
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