|
|
PDF MA4BN1840-2 Data sheet ( Hoja de datos )
| Número de pieza | MA4BN1840-2 | |
| Descripción | Monolithic HMIC Integrated Dual Bias Network | |
| Fabricantes | Tyco Electronics | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MA4BN1840-2 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
|
No Preview Available !
Monolithic HMIC Integrated Dual
Bias Network 18 - 40 GHz
V 1.00
www.DataSheet4U.com
Features
n Broad Bandwidth Specified for 18 to 40 GHz
n Useable from 15 GHz to 50 GHz
n Extremely Low Insertion Loss
n High RF-DC Isolation
n Rugged, Fully Monolithic, Glass Encapsulated
Construction
MA4BN1840-2 Chip Layout
Description
The MA4BN1840-2 device is a fully monolithic broadband bias
network utilizing M/A-COM's HMIC TM (Heterolithic Microwave
Integrated Circuit) Process, US Patent 5,268,310. This process
allows the incorporation of silicon pedestals that form vias by
imbedding them in low loss, low dispersion glass. By using small
spacing between elements, this combination of silicon and glass
gives HMIC devices low loss and high performance with
exceptional repeatability through millimeter frequencies.
Large bond pads facilitate the use of low inductance ribbon bonds,
while gold backside metalization allows for manual or automatic
die attach via 80Au/20Sn or Sn62/Pb36/Ag2 solders or electrically
conductive silver epoxy.
Applications
The MA4BN1840-2 millimeter frequency bias network is suitable
for D.C. biasing PIN Diode control circuits as a RF- DC
de-coupling network, a conventional Bias Tee, and as a D.C.
Return network. The device can also be used as a bi-directional
re-active coupler for schottky detector circuits. D.C. currents up to
150 mA and D.C. voltages up to 50 V may be used
Absolute Maximum Ratings1
@ TA = +25 °C
(Unless otherwise specified)
Parameter
Value
Operating Temperature
-65 °C to +125 °C
Storage Temperature
-65 °C to +150 °C
Die Attach Temperature
320 °C for 20 sec
RF C.W. Incident Power
10 Watts
D.C. Bias Current
+/- 150 mA
D.C. Bias Voltage
+/- 50 V
1. Exceeding any of these values may result in permanent
damage
1 page  
Monolithic HMIC Integrated Dual Bias Network 18 - 40 GHz
MA4BN1840-2
Assembly Considerations
The following precautions should be observed to avoid
damaging these chips.
Cleanliness
These chips should be handled in a clean environment. Do not
attempt to clean die after installation.
Electro-Static Sensitivity
The MA4BN1840-2 Dual Bias Network is ESD, Class 1 sensi-
tive. The proper ESD handling procedures should be used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025”
ribbon or ball bonding with 0.001” diameter gold wire is
recommended. A stage temperature of 150 oC and a force of
18 to 22 grams should be used. Ultrasonic energy should be
adjusted to the minimum required. RF bonds should be as
short as possible for best performance.
Mounting
V 1.00
These chips have Ti-Pt-Au topside and backside metal. They
can be die mounted with a gold-tin or a lead-tin-silver eutectic
solder preform or electrically conductive silver epoxy.
Mounting surface must be clean of organic contaminants and
flat for best adhesion results.
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended
with a work surface temperature of 255 oC and a tool tip
temperature of 265 oC. When hot gas is applied, the tool tip
temperature should be 290 oC. The chip should not be
exposed to temperatures greater than 320 oC for more than 20
seconds. No more than three seconds should be required for
attachment.
Electrically Conductive Expoxy
Die Attachment
Assembly should be preheated to 125-150 oC. A minimum
amount of epoxy should be used, approximately 1 to 2 mils
thickness for best electrical and thermal conductivity. A thin
epoxy fillet should be visible around the perimeter of the chip
after placement. Cure epoxy per manufacturer’s
time-temperature schedule.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
5
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MA4BN1840-2.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MA4BN1840-1 | Monolithic HMIC Integrated Network | Tyco Electronics |
| MA4BN1840-2 | Monolithic HMIC Integrated Dual Bias Network | Tyco Electronics |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |