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PDF NBB-300 Data sheet ( Hoja de datos )
| Número de pieza | NBB-300 | |
| Descripción | CASCADABLE BROADBAND GaAs MMIC AMPLIFIER | |
| Fabricantes | RF Micro Devices | |
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Hay una vista previa y un enlace de descarga de NBB-300 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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NBB-300
CASCADABLE BROADBAND
GaAs MMIC AMPLIFIER DC TO 12GHz
RoHS Compliant & Pb-Free Product
Package Style: Micro-X, 4-Pin, Ceramic
Features
Reliable, Low-Cost HBT Design
12.0dB Gain, +13.8dBm
P1dB @ 2 GHz
High P1dB of
+11.2 dBm @ 14.0 GHz
Single Power Supply Operation
50Ω I/O Matched for High Freq.
Use
Applications
Narrow and Broadband Commer-
cial and Military Radio Designs
www.DataSheet4U.com
Linear and Saturated Amplifiers
Gain Stage or Driver Amplifiers
for MWRadio/Optical Designs
(PTP/PMP/
LMDS/UNII/VSAT/WLAN/Cellu-
lar/DWDM)
Package Drawing
45°
UNITS:
Inches
(mm)
0.040
(1.02)
0.070
(1.78)
0.055
(1.40)
0.020
0.200 sq.
(5.08)
0.005
(0.13)
RF IN 1
GND
4
MARKING - N3
3 RF OUT
2
GND
Functional Block Diagram
Product Description
The NBB-300 cascadable broadband InGaP/GaAs MMIC amplifier is a low-cost,
high-performance solution for general purpose RF and microwave amplification
needs. This 50Ω gain block is based on a reliable HBT proprietary MMIC design,
providing unsurpassed performance for small-signal applications. Designed with an
external bias resistor, the NBB-300 provides flexibility and stability. The NBB-300 is
packaged in a low-cost, surface-mount ceramic package, providing ease of assem-
bly for high-volume tape-and-reel requirements. It is available in either packaged or
chip (NBB-300-D) form, where its gold metallization is ideal for hybrid circuit
designs.surface-mount ceramic package, providing ease of assembly for high-vol-
ume tape-and-reel requirements. It is available in either packaged or chip (NBB-
300-D) form, where its gold metallization is ideal for hybrid circuit designs.
Ordering Information
NBB-300
NBB-300-T1
NBB-300-D
NBB-300-E
NBB-X-K1
Cascadable Broadband GaAs MMIC Amplifier DC to 12GHz
Tape & Reel, 1000 Pieces
NBB-300 Chip Form (100 pieces minimum order)
Fully Assembled Evaluation Board
Extended Frequency InGaP Amp Designer’s Tool Kit
Optimum Technology Matching® Applied
GaAs HBT
9GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Rev A11 DS070328
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 12
1 page  
NBB-300
Die Attach
• The die attach process mechanically attaches the die to the circuit substrate. In addition, the utilization of proper die
attach processes electrically connect the ground to the trace on which the chip is mounted. It also establishes the
thermal path by which heat can leave the chip.
• Die should be mounted to a clean, flat surface. Epoxy or eutectic die attach are both acceptable attachment meth-
ods. Top and bottom metallization are gold. Conductive silver-filled epoxies are recommended. This procedure
involves the use of epoxy to form a joint between the backside gold of the chip and the metallized area of the sub-
strate.
• All connections should be made on the topside of the die. It is essential to performance that the backside be well
grounded and that the length of topside interconnects be minimized.
• Some die utilize vias for effective grounding. Care must be exercised when mounting die to preclude excess run-out
on the topside.
Die Wire Bonding
• Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are accept-
able practices for wire bonding.
• All bond wires should be made as short as possible.
Notes
1RFMD Document #6000152 - Die Product Final Visual Inspection Criteria. This document provides guidance for die inspec-
tion personnel to determine final visual acceptance of die product prior to shipping to customers.
2RFMD takes precautions to ensure that die product is shipped in accordance with quality standards established to minimize
material shift. However, due to the physical size of die-level product, RFMD does not guarantee that material will not shift dur-
ing transit, especially under extreme handling circumstances. Product replacement due to material shift will be at the discre-
tion of RFMD.
Rev A11 DS070328
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
5 of 12
5 Page 
NBB-300-T1
NBB-300-D
NBB-300-E
NBB-X-K1
Ordering Information
Tape & Reel, 1000 Pieces
NBB-300 Chip Form (100 pieces minimum order)
Fully Assembled Evaluation Board
Extended Frequency InGaP Amp Designer’s Tool Kit
NBB-300
Rev A11 DS070328
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
11 of 12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet NBB-300.PDF ] | |
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