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PDF EL7556B Data sheet ( Hoja de datos )
| Número de pieza | EL7556B | |
| Descripción | Integrated Adjustable 6 Amp Synchronous Switcher | |
| Fabricantes | Intersil Corporation | |
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®
FOR
UPDDAaTtEa DESLhIN7eF5e5Ot6RDMATION
SEE
October 5, 2001
EL7556B
FN7292
Integrated Adjustable 6 Amp
Synchronous Switcher
The EL7556B is an adjustable
synchronous DC:DC switching
regulator optimized for a 5V input and
1.0V-3.8V output. By combining integrated NMOS power
FETs with a fused-lead package, the EL7556B can supply
up to 6A continuous output current without the use of
external power devices or discrete heat sinks, thereby
minimizing design effort and overall system cost.
On-chip resistorless current sensing is used to achieve
stable, highly efficient, current-mode control. The EL7556B
also incorporates the VCC2DET function to directly interface
with the Intel P54 and P55 microprocessors. Depending on
the state of VCC2DET, the output voltage is internally preset
to 3.5V or a user-adjustable voltage using two external
resistors. In both internal and external feedback modes the
active-high PWRGD output indicates when the regulator
output is within ±10% of the programmed voltage. An on-
board sensor monitors die temperature (OT) for over-
temperature conditions and can be connected directly to
OUTEN to provide automatic thermal shutdown. Adjustable
www.DataSheet4U.coomscillator frequency and slope compensation allow added
flexibility in overall system design.
The EL7556B is available in a 28-pin SO package and is
specified for operation over the full -40°C to +85°C
temperature range.
Pinout
EL7556B
(28-PIN SO)
TOP VIEW
R4
100Ω
R3
150Ω
VIN
D3
VIN
C4 0.1µF
C7 39pF
C8 220pF
R5
5.1Ω
1 FB1
FB2 28
2 CREF
CP 27
3 CSLOPE C2V 26
4 COSC VSS 25
5 VDD
VHI 24
6 VIN
LX 23
7 VSSP
LX 22
C9
660µF
C12
1µF
C3
1µF
8 VIN
LX 21
9 VSSP
LX 20
10 VSSP VSSP 19
11 VSSP VSSP 18
C5
R1 1µF
20Ω
R6
D2 D4*
(Optional)
D1 C11
0.22µF
C 6 39.2Ω
0.1µF
L1 2.5µH
C10
1mF
VOUT =
1V*(1+R3/R4)
Connect to VSSP for
external feedback
C12 - 1µF
C3, C4, C5, C6, C7 C8 - ceramic
C5, C11 - ceramic or tantalum
C9 - Sprague 293D337X96R3 2X330µF
C10 - Sprague 293D337X96R3 3X330µF
L1 - Pulse Engineering, PE-53681
D1-D4: BAT54S fast diode
D4 Required for EL7556ACM Only
12 VSSP TEST 17
13
VCC2DET
PWRGD
16
14 OUTEN
OT 15
Manufactured under U.S. Patents No. 5,723,974 and No. 5,793,126
Features
• EL7556/EL7556A Pin-compatible
• Improved temperature and voltage ranges
• 6A continuous load current
• Precision internal 1% reference
• 1.0V to 3.8V output voltage
• Internal power MOSFETs
• >90% efficiency
• Synchronous switching
• Adjustable slope compensation
• Over-temperature indicator
• Pulse-by-pulse current limiting
• Operates up to 1MHz
• 1.5% typical output accuracy
• Adjustable oscillator with sync
• Remote enable/disable
• Intel P54- and P55-compatible
• VCC2DET interface
• Internal soft-start
Applications
• PC motherboards
• Local high power CPU supplies
• 5V to 1.0V DC:DC conversion
• Portable electronics/instruments
• P54 and P55 regulators
• GTL + Bus power supply
Ordering Information
PART NUMBER
EL7556BCM
EL7556BCM-T13
PACKAGE
28-Pin SO
28-Pin SO
TAPE &
REEL
-
13”
PKG. NO.
MDP0027
MDP0027
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved. Elantec is a registered trademark of Elantec Semiconductor, Inc.
All other trademarks mentioned are the property of their respective owners.
1 page  
EL7556B
Typical Performance Curves (Continued)
Line Regulation vs CSLOPE
VIN=VDD=5.0V ±10%
0.8
0.7
0.6
0.5
0.4 IOUT=6A
0.3
0.2 IOUT=0.5A
0.1
0.0
50
75 100 125
CSLOPE (pF)
TA=25°C
150 175
VOUT vs CSLOPE
(VIN=5.0V, ILOAD=0.5A)
1.5
1.0
0.5
0.0 VOUT=1V
-0.5
VOUT=2.5V
-1.0 VOUT=3.5V
-1.5
-2.0
-2.5
-3.0
50
TA=25°C
75 100 125 150 175
CSLOPE (pF)
FOSC vs COSC
10000
1000
TA=25°C
100
10
1
10 100 1k 100k
COSC (pF)
Load Regulation vs CSLOPE
IOUT=3A, +3A, -2.5A
0.8
0.7
0.6
0.5
0.4 VIN=4.5V
0.3
0.2 VIN=5V
VIN=5.5V
0.1
0.0
50
75 100 125
CSLOPE (pF)
TA=25°C
150 175
VOUT Variation vs Programmed Output
Voltage [VIDEAL=(1+R3/R4)]
1.5
1.0
C
0.5
0.0
COSSCLO=2P2E0=p1F00pF
-0.5
-1.0
Loop Gain Induced Error
-1.5
1.0 1.5 2.0 2.5
VIDEAL (V)
3.0
TA=25°C
3.5 4.0
FOSC vs Temperature
520
510
VDD=4.5V
500
490 VDD=5.5V
480
470 VDD=5V
460
450
0
20 40 60 80 100 120 140
Temperature (°C)
5
5 Page 
EL7556B
Operating frequency can be adjusted through the COSC pin
or can be driven by an external clock source. If the oscillator
is driven by an external source, care must be taken in the
selection of CSLOPE. Since the COSC and CSLOPE values
determine the open loop gain of the system, changes to
COSC require corresponding changes to CSLOPE in order to
maintain a constant gain ratio. The recommended ratio of
COSC to CSLOPE is 1.5:1
Temperature Sensor
An internal temperature sensor continuously monitors die
temperature. In the event that die temperature exceeds the
thermal trip-point, the OT pin will output a logic 0. The upper
and lower trip points are set to 135°C and 100°C
respectively. To enable thermal shutdown this pin should be
tied directly to OUTEN. Use of this feature is recommended
during normal operation.
Power Good and Power On Reset
During power up the output regulator will be disabled until
VIN reaches a value of approximately 4.0V. Approximately
500mV of hysteresis is present to eliminate noise induced
oscillations.
Under-voltage and over-voltage conditions on the regulator
output are detected through an internal window comparator.
A logic 1 on the PWRGD output indicates that regulated
output voltage is within ±10% of the nominally programmed
output voltage. Although small, the typical values of the
PWRGD threshold will vary with changes to external
feedback (and resultant loop gain) of the system. This
dependence is shown in the typical performance curves.
Thermal Management
The EL7556B utilizes “fused lead” packaging technology in
conjunction with the system board layout to achieve a lower
thermal resistance than typically found in standard 28-pin
SO packages. By fusing (or connecting) multiple external
leads to the die substrate within the package, a very
conductive heat path to the outside of the package is
created. This conductive heat path MUST then be connected
to a heat sinking area on the PCB in order to dissipate heat
out and away from the device. The conductive paths for the
EL7556B package are the fused leads: # 7, 9, 10, 11, 12, 18,
and 19. If a sufficient amount of PCB metal area is
connected to the fused package leads, a junction-to-ambient
thermal resistance of approximately 31°C/W can be
achieved (compared to 78°C/W for a standard SO28
package). The general relationship between PCB heat-
sinking metal area and the thermal resistance for this
package is shown in the Performance Curves section of this
data sheet. It can be readily seen that the thermal resistance
for this package approaches an asymptotic value of
approximately 31°C/W without any airflow. Additional
information can be found in Application Note #8 (Measuring
the Thermal Resistance of Power Surface-Mount Packages).
If the thermal shutdown pin is connected to OUTEN the IC
will enter thermal shutdown when the maximum junction
temperature is reached. For a thermal shutdown of 135°C
and power dissipation of 2.2W the ambient temperature is
limited to a maximum value of 67°C (typical). The ambient
temperature range can be extended with the application of
air flow. For example, the addition of 100LFM reduces the
thermal resistance by approximately 15% and can extend
the operating ambient to 77°C (typical). Since the thermal
performance of the IC is heavily dependent on the board
layout, the system designer should exercise care during the
design phase to ensure that the IC will operate under the
worst-case environmental conditions.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
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| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet EL7556B.PDF ] | |
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