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PDF NTD65N03R Data sheet ( Hoja de datos )
| Número de pieza | NTD65N03R | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTD65N03R
Power MOSFET
25 V, 65 A, Single N−Channel, DPAK
Features
• Low RDS(on)
• Ultra Low Gate Charge
• Low Reverse Recovery Charge
• Pb−Free Packages are Available
Applications
• Desktop CPU Power
• DC−DC Converters
• High and Low Side Switch
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (RqJC) Limited
by Die
TC = 25°C
TC = 85°C
VDSS
VGS
ID
25
"20
65
45
V
V
A
Continuous Drain
Steady TC = 25°C
Current (RqJC) Limited State
by Wire
ID
32 A
Power Dissipation
(RqJC)
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
TC = 25°C
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
PD
ID
PD
ID
PD
50 W
11.4 A
8.9
1.88 W
9.5 A
7.4
1.3 W
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage
Temperature
IDM
TJ, Tstg
130
−55 to
175
A
°C
Drain−to−Source (dv/dt)
dv/dt
2.0 V/ns
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (VDD = 24 V, VGS = 10 V, IL = 12 A,
L = 1.0 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IS
EAS
TL
2.1 A
71.7 mJ
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.15 in sq) [1 oz] including traces.
http://onsemi.com
V(BR)DSS
25 V
RDS(on) TYP
6.5 mW @ 10 V
9.7 mW @ 4.5 V
N−Channel
D
ID MAX
65 A
G
S
44
4
12
3
CASE 369AA
DPAK
(Bend Lead)
STYLE 2
1
2
3
CASE 369D
DPAK
(Straight Lead)
STYLE 2
1 23
CASE 369AC
3 IPAK
(Straight Lead)
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
1
Gate
2
Drain
3
Source
13
Gate 2 Source
Drain
Y = Year
WW = Work Week
65N03 = Device Code
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev. 3
1
Publication Order Number:
NTD65N03R/D
1 page  
NTD65N03R
ORDERING INFORMATION
Order Number
Package
Shipping†
NTD65N03R
DPAK−3
75 Units / Rail
NTD65N03RG
DPAK−3
(Pb−Free)
75 Units / Rail
NTD65N03RT4
DPAK−3
2500 / Tape & Reel
NTD65N03RT4G
DPAK−3
(Pb−Free)
2500 / Tape & Reel
NTD65N03R−1
DPAK−3 Straight Lead
75 Units / Rail
NTD65N03R−1G
DPAK−3 Straight Lead
(Pb−Free)
75 Units / Rail
NTD65N03R−35
DPAK Straight Lead Trimmed
(3.5 ± 0.15 mm)
75 Units / Rail
NTD65N03R−35G
DPAK Straight Lead Trimmed
(3.5 ± 0.15 mm)
(Pb−Free)
75 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet NTD65N03R.PDF ] | |
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