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Numéro de référence | NLASB3157 | ||
Description | SPDT / 3 ohm RON Switch | ||
Fabricant | ON Semiconductor | ||
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1 Page
NLASB3157
SPDT, 3 W RON Switch
The NLASB3157 is an advanced CMOS analog switch fabricated
with silicon gate CMOS technology. It achieves very low
propagation delay and RDSON resistances while maintaining CMOS
low power dissipation. Analog and digital voltages that may vary
across the full power−supply range (from VCC to GND). This device
is a drop in replacement for the NC7SB3157.
The select pin has overvoltage protection that allows voltages
above VCC, up to 7.0 V to be present on the pin without damage or
disruption of operation of the part, regardless of the operating
voltage.
Features
• High Speed: tPD = 1.0 ns (Typ) at VCC = 5.0 V
• Low Power Dissipation: ICC = 2.0 mA (Max) at TA = 25°C
• Standard CMOS Logic Levels
• High Bandwidth, Improved Linearity
• Switches Standard NTSC/PAL Video, Audio, SPDIF and HDTV
• May be used for Clock Switching, Data Multiplexing, etc.
• RON Typical = 3 W @ VCC = 4.5 V
• Break Before Make Circuitry, Prevents Inadvertent Shorts
• 2 Devices can Switch Balanced Signal Pairs,
www.DataSheet4U.com e.g. LVDS u 200−Mb/s
• Latchup Performance Exceeds 300 mA
• Pin for Pin Drop in for NC7SB3157
• Tiny SC88 and WDFN6 Packages
• ESD Performance:
♦ Human Body Model; u 2000 V;
♦ Machine Model; u 200 V
• Extended Automotive Temperature Range −55°C to +125°C
(See Appendix)
• Pb−Free Packages are Available
http://onsemi.com
MARKING
DIAGRAMS
6
1
SC−88
DF SUFFIX
CASE 419B
AF MG
G
WDFN6
MT SUFFIX
CASE 506AS
FM
G
AF, F = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
FUNCTION TABLE
Select Input
Function
L B0 Connected to A
H B1 Connected to A
ORDERING INFORMATION
Device
Package Shipping†
NLASB3157DFT2 SC−88 3000 Tape & Reel
NLASB3157DFT2G SC−88 3000 Tape & Reel
(Pb−Free)
NLASB3157MTR2G WDFN6 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 9
1
Publication Order Number:
NLASB3157/D
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Pages | Pages 10 | ||
Télécharger | [ NLASB3157 ] |
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