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Número de pieza | NL17SZ17 | |
Descripción | Single Non-Inverting Buffer | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! NL17SZ17
Single Non-Inverting Buffer
with Schmitt Trigger
The NL17SZ17 is a single Non−inverting Schmitt Trigger Buffer in
three tiny footprint packages. The device performs much as LCX
multi−gate products in speed and drive.
Features
• Tiny SOT−353, SOT−553 and SOT−953 Packages
• Source/Sink 24 mA at 3.0 Volts
• Chip Complexity: FETs = 20
• Designed for 1.65 V to 5.5 V VCC Operation
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
NC
1
A
2
GND
3
VCC
A
51
GND
2
Y NC
43
VCC
5
Y
4
SOT−353/SC70−5/
SC−88A/SOT−553
SOT−953
Figure 1. Pinout (Top View)
AY
Figure 2. Logic Symbol
www.onsemi.com
5
1
MARKING
DIAGRAMS
SC−88A
5
(SC−70−5/SOT−353)
DF SUFFIX
CASE 419A
LX MG
G
1
5
1
SOT−553
XV5 SUFFIX
CASE 463B
5
LX MG
G
1
LX = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
SOT−953
CASE 527AE
M
1
A = Specific Device Code
(A with 90 degree clockwise rotation)
M = Month Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
PIN ASSIGNMENT
(SOT−353/SC70−5/SC−88A/SOT−553)
Pin Function
1 NC
2A
3 GND
4Y
5 VCC
PIN ASSIGNMENT (SOT−953)
Pin Function
1 IN A
2 GND
3 NC
4Y
5 VCC
FUNCTION TABLE
Input
A
L
H
Output
Y
L
H
© Semiconductor Components Industries, LLC, 2016
January, 2016 − Rev. 16
1
Publication Order Number:
NL17SZ17/D
1 page NL17SZ17
DEVICE ORDERING INFORMATION
Device Order
Number
NL17SZ17DFT2G
Package
Type
SC−88A/SC−70−5/SOT−353
(Pb−Free)
Tape/Reel Size†
3000 Units / Tape & Reel
NLV17SZ17DFT2G*
SC−88A/SC−70−5/SOT−353
(Pb−Free)
3000 Units / Tape & Reel
NL17SZ17XV5T2G
SOT−553
(Pb−Free)
4000 Units / Tape & Reel
NL17SZ17XV5T2GH
SOT−553
(Pb−Free)
4000 Units / Tape & Reel
NL17SZ17P5T5G
SOT−953
(Pb−Free)
8000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
D
−X− A
54
12 3
E
−Y−
b 5 PL
e 0.08 (0.003) M X Y
SOT−553
XV5 SUFFIX
CASE 463B
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
L
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
HE
MILLIMETERS
DIM MIN NOM MAX
INCHES
MIN NOM MAX
A 0.50
0.55
0.60
0.020 0.022 0.024
b 0.17 0.22 0.27 0.007 0.009 0.011
c
c 0.08
D 1.50
0.13
1.60
0.18
1.70
0.003
0.059
0.005
0.063
0.007
0.067
E 1.10
1.20
1.30
0.043 0.047 0.051
e 0.50 BSC
0.020 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
H E 1.50
1.60
1.70
0.059 0.063 0.067
SOLDERING FOOTPRINT*
0.3
0.0118
1.35
0.0531
1.0
0.0394
0.45
0.0177
0.5 0.5
0.0197 0.0197
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet NL17SZ17.PDF ] |
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