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PDF W3EG7236S-D3 Data sheet ( Hoja de datos )

Número de pieza W3EG7236S-D3
Descripción 256MB - 32Mx72 DDR SDRAM REGISTERED
Fabricantes White Electronic 
Logotipo White Electronic Logotipo



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No Preview Available ! W3EG7236S-D3 Hoja de datos, Descripción, Manual

White Electronic Designs
W3EG7236S-D3
PRELIMINARY*
256MB – 32Mx72 DDR SDRAM REGISTERED, w/PLL
FEATURES
DESCRIPTION
Speeds of 100MHz and 133 MHz
Double-data-rate architecture
Bi-directional data strobes (DQS)
Differential clock inputs (CK & CK#)
Programmable Read Latency 2,2,5 (clock)
Programmable Burst Length (2,4,8)
Programmable Burst type (sequential & interleave)
Edge aligned data output, center aligned data input
Auto and self refresh
Serial presence detect
184 pin DIMM package
Power Supply: 2.5V ± 0.20V
www.DataSheet4U.com
The W3EG7236S is a 32Mx72 Double Data Rate
SDRAM memory module based on 256Mb DDR
SDRAM component. The module consists of nine
32Mx8 DDR SDRAMs in 66 pin TSOP package
mounted on a 184 Pin FR4 substrate.
Synchronous design allows precise cycle control with
the use of system clock. Data I/O transactions are
possible on both edges and Burst Lenths allow the
same device to be useful for a variety of high bandwidth,
high performance memory system applications.
* This product is under development, is not qualified or characterized and is subject to
change without notice.
Clock Speed
CL-tRCD-tRP
OPERATING FREQUENCIES
DDR266 @CL=2
133MHz
2-3-3
DDR266 @CL=2.5
133MHz
2.5-3-3
DDR200 @CL=2
100MHz
2-2-2
November 2004
Rev. 1
1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

1 page




W3EG7236S-D3 pdf
White Electronic Designs
W3EG7236S-D3
PRELIMINARY
IDD SPECIFICATIONS AND TEST CONDITIONS
0°C TA 70°C, VCCQ = 2.5V ± 0.2V, VCC = 2.5V ± 0.2V
Includes DDR SDRAM component only
Parameter
Symbol Conditions
Operating Current
IDD0 One device bank; Active - Precharge;
tRC=tRC (MIN); tCK=tCK (MIN); DQ,DM
and DQS inputs changing once per
clock cycle; Address and control
inputs changing once every two
cycles.
Operating Current
IDD1 One device bank; Active-Read-
Precharge Burst = 2; tRC=tRC (MIN);
tCK=tCK (MIN); lOUT = 0mA; Address
and control inputs changing once per
clock cycle.
Precharge Power-
Down Standby
Current
IDD2P All device banks idle; Power-down
mode; tCK=tCK (MIN); CKE=(low)
Idle Standby Current IDD2F CS# = High; All device banks idle;
tCK=tCK (MIN); CKE = high; Address
and other control inputs changing
once per clock cycle. VIN = VREF for
DQ, DQS and DM.
Active Power-Down
Standby Current
IDD3P One device bank active; Power-Down
mode; tCK (MIN); CKE=(low)
Active Standby
Current
IDD3N CS# = High; CKE = High; One device
bank; Active-Precharge; tRC=tRAS
(MAX); tCK=tCK (MIN); DQ, DM and
DQS inputs changing twice per clock
cycle; Address and other control
inputs changing once per clock cycle.
Operating Current
IDD4R Burst = 2; Reads; Continuous burst;
One device bank active; Address
and control inputs changing once
per clock cycle; TCK= TCK (MIN); lOUT
= 0mA.
Operating Current
IDD4W Burst = 2; Writes; Continuous burst;
One device bank active; Address
and control inputs changing once per
clock cycle; tCK=tCK (MIN); DQ,DM
and DQS inputs changing once per
clock cycle.
Auto Refresh
Current
IDD5 tRC = tRC (MIN)
Self Refresh Current IDD6 CKE 0.2V
Operating Current
IDD7A Four bank interleaving Reads (BL=4)
with auto precharge with tRC=tRC
(MIN); tCK=tCK (MIN); Address and
control inputs change only during
Active Read or Write commands.
DDR266@CL=2
Max
810
1080
27
225
315
495
1530
1530
1620
27
2925
DDR266@CL=2.5
Max
720
990
27
180
270
405
1260
1260
1485
27
2520
DDR200@CL=2
Max
Units
675 mA
900 mA
27 rnA
162 mA
225 mA
360 mA
1080 mA
1035 rnA
1350 mA
27 mA
2115 mA
November 2004
Rev. 1
5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

5 Page





W3EG7236S-D3 arduino
White Electronic Designs
W3EG7236S-D3
PRELIMINARY
Part Number
W3EG7236S262D3
W3EG7236S265D3
W3EG7236S202D3
ORDER INFORMATION FOR D3
Speed
133MHz/266Mbps
133MHz/266Mbps
100MHz/200Mbps
CAS Latency
2
2.5
2
tRCD
2
3
2
tRP
2
3
2
Height*
26.67 (1.05")
26.67 (1.05")
26.67 (1.05")
PACKAGE DIMENSIONS FOR D3
3.99
(0.157)
(4X)
17.78
(0.700)
10.01
(0.394)
6.35
(0.250)
133.48
(5.255)
MAX
64.77
(2.550)
6.35
(0.250)
1.78
(0.070)
26.67
(1.050)
MAX
3.99
(0.157)
MAX
4.06
(0.160)
MAX
1.27 (0.050) TYP
49.53
(1.950)
3.00
(0.118)
(4X)
1.27 ± 0.10
(0.050 ± 0.004)
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES).
November 2004
Rev. 1
11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

11 Page







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