FMS2013 Datasheet PDF - Filtronic
| Part Number | FMS2013 | |
| Description | SPDT GaAs High Isolation Absorptive Switch DC-4 GHz | |
| Manufacturers | Filtronic | |
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There is a preview and FMS2013 download ( pdf file ) link at the bottom of this page. Total 5 Pages | ||
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Preliminary Data Sheet 2.1
FMS2013
SPDT GaAs High Isolation Absorptive Switch DC-4 GHz
Features:
♦ Available as RF Known Good Die
♦ Excellent low control voltage performance
♦ Excellent harmonic performance
♦ Very high isolation >49dB typ. up to 4GHz
♦ Very low Tx Insertion loss <1.0 dB at 4GHz
Functional Schematic
V2
V1
RFIN
RF01
RF02
Description and Applications:
The FMS2013 is a low loss, high power, linear single-pole double-throw Gallium Arsenide switch
designed for general purpose applications over the frequency range DC-4GHz. The die is fabricated
using the Filtronic FL05 0.5µm switch process technology which offers market leading performance
optimised for switch applications.
Electrical Specifications: (TOP = 25°C,Vctrl = 0V/2.5V, ZIN = ZOUT = 50Ω)
Parameter
Test Conditions
Min Typ
Tx Insertion Loss
Rx Insertion Loss
Return Loss
VSWR On State
VSWR Off State
Isolation at 4 GHz
2nd Harmonic Level
Switching speed
4GHz
4GHz
4GHz
4GHz
4GHz
4GHz
3GHz, Pin = 21dBm, Vctrl = 3V
3GHz, Pin = 27dBm, Vctrl = 5V
Pin = 21dBm, 10% to 90% RF
1.0
1.0
15
1:1.3
1:1.4
49
-72
-68
30
Note: External DC blocking capacitors are required on all RF ports (typ: 47pF).
Max
Units
dB
dB
dB
dB
dBc
dBc
ns
1
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: [email protected]
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: [email protected]
Website: www.filcs.com
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Preliminary Data Sheet 2.1
Ordering Information:
Part Number
FMS2013-000-WP
FMS2013-000-GP
FMS2013-000-EB
FMS2013-000-FF
Description
Die – waffle pak
Die – gel pak
Die mounted on evaluation board
Wafer mounted on film frame
FMS2013
Preferred Assembly Instructions:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be
used where possible.
The back of the die is not metallised and the recommended mounting method is by the use of
conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid
encroachment of epoxy on to the top face of the die and ideally should not exceed half the chip height.
For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1
LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150°C for 1 hour in
an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with
dry nitrogen.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is
recommended that 25.4µm diameter gold wire is used. Thermosonic ball bonding is preferred. A
nominal stage temperature of 150°C and a bonding force of 40g has been shown to give effective
results for 25µm wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique,
stage temperature should not be raised above 200°C and bond force should not be raised above 60g.
Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve
good wire bonds.
Bonds should be made from the die first and then to the mounting substrate or package. The physical
length of the bondwires should be minimised especially when making RF or ground connections.
Handling Precautions:
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A (0-500 V) as defined in JEDEC Standard No.
22-A114-B. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-
HDBK-263.
Disclaimers:
This product is not designed for use in any space based or life sustaining/supporting equipment.
5
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: [email protected]
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: [email protected]
Website: www.filcs.com
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for FMS2013 electronic component. |
| Information | Total 5 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ FMS2013.PDF Datasheet ] | |
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