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Número de pieza | FMA3008 | |
Descripción | BROADBAND MMIC AMPLIFIER | |
Fabricantes | Filtronic | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de FMA3008 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
No Preview Available ! 2-20GHZ BROADBAND MMIC AMPLIFIER
FMA3008
Preliminary Datasheet v2.1
FEATURES:
• Cascode Configuration
• 11dB Gain
• pHEMT Technology
• AGC control with gate bias
• Input Return Loss <-15dB
• Output Return Loss <-10dB
• Medium Power 20dBm
FUNCTIONAL SCHEMATIC:
RF Input
VDD
RF Output
GENERAL DESCRIPTION:
The FMA3008 is a high performance 2-20GHz
Gallium Arsenide monolithic travelling wave
amplifier. It is suitable for use in broadband
communication, instrumentation and electronic
warfare applications. The die is fabricated
using the Filtronic 0.25µm process. The
cascode gate voltage is supplied on Chip, with
the option of supplying an external voltage.
The Circuit is DC blocked at both the input and
output.
VG
TYPICAL APPLICATIONS:
• Test Instrumentation
• Electronic Warfare
• Broadband Communication Infrastructure
ELECTRICAL SPECIFICATIONS:
PARAMETER
Small Signal Gain
Input Return Loss
Output Return Loss
CONDITIONS
2-20GHz
2-20GHz
2-20GHz
Reverse Isolation
2-20GHz
Output Power at 1dB
compression point
Noise Figure
10GHz
18GHz
2-20GHz
Gate Voltage
For Id=120mA
Note: TAMBIENT = +25°C, Z0 = 50Ω, VD=6V
MIN
TYP
11
-10
-14
<-40
23.5
22.5
4.5
-0.3
MAX
UNITS
dB
dB
dB
dB
dBm
dBm
dB
V
Tel: +44 (0) 1325 301111
1
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
1 page PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The recommended die attach is gold/tin
eutectic solder under a nitrogen atmosphere.
Stage temperature should be 280-290°C;
maximum time at temperature is one minute.
The recommended wire bond method is
thermo-compression wedge bonding with 0.7
or 1.0 mil (0.018 or 0.025 mm) gold wire.
Stage temperature should be 250-260°C.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
FMA3008
Preliminary Datasheet v2.1
ORDERING INFORMATION:
PART NUMBER
FMA3008
DESCRIPTION
Die in Waffle-pack
(Gel-pak available on request)
HANDLING
PRECAUTIONS:
To avoid damage to the devices care should
be exercised during handling. Proper
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing. These
devices should be treated as Class 1A (0-500
V) as defined in JEDEC Standard No. 22-
A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters, noise data and large-signal
models are available on request.
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
5
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet FMA3008.PDF ] |
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