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PDF NST30010MXV6T1G Data sheet ( Hoja de datos )
| Número de pieza | NST30010MXV6T1G | |
| Descripción | Dual Matched General Purpose Transistor | |
| Fabricantes | ON Semiconductor | |
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NST30010MXV6T1G
Dual Matched General
Purpose Transistor
PNP Matched Pair
These transistors are housed in an ultra−small SOT563 package
ideally suited for portable products. They are assembled to create a
pair of devices highly matched in all parameters, eliminating the need
for costly trimming. Applications are Current Mirrors; Differential,
Sense and Balanced Amplifiers; Mixers; Detectors and Limiters.
Features
• Current Gain Matching to 10%
• Base−Emitter Voltage Matched to 2 mV
• Drop−In Replacement for Standard Device
• These are Pb−Free Devices
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector −Emitter Voltage
VCEO
−30
V
Collector −Base Voltage
VCBO
−30
V
Emitter −Base Voltage
VEBO
−5.0
V
Collector Current − Continuous
IC
−100
mAdc
www.DataSheet4U.com
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
(3) (2) (1)
Q1 Q2
(4) (5)
(6)
6
1
SOT−563
CASE 463A
PLASTIC
MARKING DIAGRAMS
UU M G
G
1
UU = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NST30010MXV6T1G SOT−563 4000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 0
1
Publication Order Number:
NST30010MXV6/D
1 page  
NST30010MXV6T1G
D
−X−
654
12 3
E
−Y−
b 65 PL
e 0.08 (0.003) M X Y
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
HE
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.50 0.55 0.60 0.020 0.021 0.023
b 0.17 0.22 0.27 0.007 0.009 0.011
C
STYLE 1:
PIN 1. EMITTER 1
C 0.08 0.12 0.18 0.003 0.005 0.007
D 1.50 1.60 1.70 0.059 0.062 0.066
2. BASE 1
E 1.10 1.20 1.30 0.043 0.047 0.051
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
e 0.5 BSC
0.02 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
HE 1.50 1.60 1.70 0.059 0.062 0.066
SOLDERING FOOTPRINT*
0.3
0.0118
1.35
0.0531
1.0
0.0394
0.45
0.0177
0.5 0.5
0.0197 0.0197
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
5
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