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PDF NCV1009 Data sheet ( Hoja de datos )
| Número de pieza | NCV1009 | |
| Descripción | 2.5 Volt Reference | |
| Fabricantes | ON Semiconductor | |
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NCV1009
2.5 Volt Reference
The NCV1009 is a precision trimmed 2.5 V ±5.0 mV shunt
regulator diode. The low dynamic impedance and wide operating
current range enhances its versatility. The tight reference tolerance is
achieved by on−chip trimming which minimizes voltage tolerance and
temperature drift.
A third terminal allows the reference voltage to be adjusted ±5.0%
to calibrate out system errors. In many applications, the NCV1009Z
can be used as a pin−to−pin replacement of the LT1009CZ and the
LM136Z−2.5 with the external trim network eliminated.
Features
• 0.2% Initial Tolerance Max.
• Guaranteed Temperature Stability
• Maximum 0.6 W Dynamic Impedance
• Wide Operating Current Range
• Directly Interchangeable with LT1009 and LM136 for Improved
Performance
• No Adjustments Needed for Minimum Temperature Coefficient
• Meets Mil Std 883C ESD Requirements
• Extended Operating Temperature Range for Use in Automotive
Applications
• NCV Prefix, for Automotive and Other ApplicationswwRw.eDqatauSihreeitn4Ug.coSmite
and Change Control
• Pb−Free Packages are Available
http://onsemi.com
8
1
SOIC−8
D SUFFIX
CASE 751
MARKING
DIAGRAMS
8
1009D
ALYW
G
1
TO−92
Z SUFFIX
CASE 29
1009Z
ALYWWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
WW, W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
1
NC
8
NC
NC NC
NC
GND
VREF
ADJ. PIN
5.0 V−35 V
VREF
3.6 kW
ADJ
GND
10 kW∗
TRIM
*±5.0% Trim Range
If the external trim resistor is not used, the “ADJ. PIN” should
be left floating. The 10k trim potentiometer does not effect the
temperature coefficient of the device.
Figure 1. Application Diagram
Pin 1. ADJ. PIN
2. VREF
3. GND
1 23
ORDERING INFORMATION
Device
Package
Shipping
NCV1009D
SOIC−8
95 Units/Rail
NCV1009DR2
SOIC−8 2500 Tape & Reel
NCV1009DR2G
SOIC−8 2500 Tape & Reel
(Pb−Free)
NCV1009Z
TO−92 2000 Units/Rail
NCV1009ZG
TO−92 2000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 9
1
Publication Order Number:
NCV1009/D
1 page  
NCV1009
PACKAGE DIMENSIONS
SOIC−8
CASE 751−07
ISSUE AG
−X−
A
B
−Y−
−Z−
H
85
S 0.25 (0.010) M Y M
1
4
K
G
D
C
SEATING
PLANE
N X 45 _
0.10 (0.004)
M
0.25 (0.010) M Z Y S X S
J
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0_ 8_ 0_ 8_
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
7.0
0.275
1.52
0.060
4.0
0.155
0.6
0.024
1.270
0.050
ǒ ǓSCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NCV1009.PDF ] | |
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