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PDF NTLTS3107P Data sheet ( Hoja de datos )
| Número de pieza | NTLTS3107P | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTLTS3107P
Power MOSFET
−20 V, −8.3 A, Single P−Channel,
Micro8 Leadless Package
Features
• Low RDS(on) for Extended Battery Life
• Surface Mount Micro8 Leadless for Improved Thermal Performance
• Low Profile (<1.0 mm) Optimal for Portable Designs
• Low Turn−On Voltage
• This is a Pb−Free Device
Applications
• Optimized for Load Management Applications
• Charge Control in Battery Powered Systems
• Cell Phones, DSC, Notebooks, Portable Games, etc.
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Steady State
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
t v 10 s
Steady State
t v 10 s
Steady State
Power Dissipation
(Note 2)
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
TA = 25°C
TA = 85°C
TA = 25°C
VDSS
VGS
ID
PD
ID
PD
−20 V
$8.0
−8.3
V
A
−6.0
−12
1.6 W
www.DataSheet4U.com
3.3
−5.9 A
−3.7
0.8 W
Pulsed Drain
Current (Note 1)
tp = 10 ms
IDM −25 A
Operating Junction and Storage Temperature
TJ, TSTG −55 to °C
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
IS −1.6 A
TL 260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
RqJA
80 °C/W
Junction−to−Ambient – t v 10 s (Note 1)
RqJA
38 °C/W
Junction−to−Ambient – Steady State (Note 2)
RqJA
160 °C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface−mounted on FR4 board using 1 sq. in. pad size
(Cu. area = 1.127 sq. in. [1 oz] including traces).
2. Surface−mounted on FR4 board using minimum recommended pad size
(Cu. area = TBD sq. in.).
http://onsemi.com
V(BR)DSS
−20 V
RDS(on) TYP
12.2 mW @ −4.5 V
15.6 mW @ −2.5 V
26.2 mW @ −1.8 V
ID MAX
−8.3 A
P−Channel MOSFET
S
G
D
MARKING
DIAGRAM
1
Micro8 Leadless
CASE 846C
1 3107
AYWW
G
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
PIN ASSIGNMENT
Drain 8
Drain 7
Drain 6
Drain 5
Drain
1 Source
2 Source
3 Source
4 Gate
(Bottom View)
ORDERING INFORMATION
Device
Package
Shipping†
NTLTS3107PR2G
Micro8
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 0
1
Publication Order Number:
NTLTS3107P/D
1 page  
NTLTS3107P
PACKAGE DIMENSIONS
MICRO8 LEADLESS
CASE 846C−01
ISSUE B
A
ÉÉÉÉÉÉÉÉÉINDEX AREA
2X
0.15 T
2X
0.15 T
TOP VIEW
NOTE 4
0.10 T W Y
0.05 T W
D 8X
E
81
G 6X
7
6
2
3
DETAIL Z
U 4X
54
H
VIEW AA−AA
W
Y
B
L 8X
F
P
T
SEATING
PLANE
J
AA
8
7
NOTE 6
6
5
0.10 T
8X
0.08 T
K AA
C
SIDE VIEW
L1 NOTE 4
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. THE TERMINAL #1 IDENTIFIER AND TERMINAL
NUMBERING CONVENTION SHALL CONFORM TO
JESD 95−1 SPP−012. DETAILS OF TERMINAL #1
IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE
TERMINAL #1 IDENTIFIER MAY BE EITHER A
MOLD OR MARKED FEATURE.
4. DIMENSION D APPLIES TO METALLIZED
TERMINAL AND IS MEASURED BETWEEN
0.25 MM AND 0.30 MM FROM TERMINAL TIP.
DIMENSION L1 IS THE TERMINAL PULL BACK
FROM PACKAGE EDGE, UP TO 0.1 MM IS
ACCEPTABLE. L1 IS OPTIONAL.
5. DEPOPULATION IS POSSIBLE IN A
SYMMETRICAL FASHION.
6. OPTIONAL SIDE VIEW CAN SHOW LEADS 5 AND
8 REMOVED.
MILLIMETERS
DIM MIN MAX
A 3.30 BSC
B 3.30 BSC
C 0.85 0.95
D 0.25 0.35
E 1.30 1.50
F 2.55 2.75
G 0.65 BSC
H 0.95 1.15
J 0.25 BSC
K 0.00 0.05
L 0.35 0.45
L1 0.00 0.10
P 1.28 1.38
U 0.20 −−−
DETAIL Z
SOLDERING FOOTPRINT*
2.75
1.23
1.50
3.60
0.40
8X 0.58
8X 0.33
0.65 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NTLTS3107P/D
5 Page | ||
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| PDF Descargar | [ Datasheet NTLTS3107P.PDF ] | |
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