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PDF NTJD4401N Data sheet ( Hoja de datos )
| Número de pieza | NTJD4401N | |
| Descripción | Small Signal MOSFET | |
| Fabricantes | ON Semiconductor | |
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NTJD4401N
Small Signal MOSFET
20 V, Dual N−Channel, SC−88
ESD Protection
Features
• Small Footprint (2 x 2 mm)
• Low Gate Charge N−Channel Device
• ESD Protected Gate
• Same Package as SC−70 (6 Leads)
• Pb−Free Packages are Available
Applications
• Load Power switching
• Li−Ion Battery Supplied Devices
• Cell Phones, Media Players, Digital Cameras, PDAs
• DC−DC Conversion
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Units
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current
(Based on RqJA)
Power Dissipation
(Based on RqJA)
Continuous Drain
Current
(Based on RqJL)
Power Dissipation
(Based on RqJL)
Pulsed Drain Current
Steady TA = 25°C
State
TA = 85°C
Steady TA = 25°C
State
TA = 85°C
Steady TA = 25°C
State
TA = 85°C
Steady TA = 25°C
State
TA = 85°C
t ≤10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
PD
ID
PD
IDM
TJ, TSTG
20 V
±12 V
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0.63 A
0.46
0.27 W
0.14
0.91 A
0.65
0.55 W
0.29
±1.2
−55 to
150
A
°C
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IS 0.63 A
TL 260 °C
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Typ Max Units
Junction−to−Ambient – Steady State
RqJA 400 460 °C/W
Junction−to−Lead (Drain) – Steady State RqJL 194 226
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 oz Cu area = 0.9523 in sq.
http://onsemi.com
V(BR)DSS
8V
RDS(on) Typ
0.22 W @ 4.5 V
0.32 W @ 2.5 V
0.51 W @ 1.8 V
ID Max
0.775 A
SC−88 (SOT−363)
S1 1
6 D1
G1 2
5 G2
D2 3
4 S2
Top View
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
1
SC−88/SOT−363
CASE 419B
STYLE 28
6
TD M G
G
1
S1 G1 D2
TD = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 3
1
Publication Order Number:
NTJD4401N/D
1 page  
NTJD4401N
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
D
e
654
HE −E−
123
A3
b 6 PL
0.2 (0.008) M E M
L
C
A
A1 SOLDERING FOOTPRINT*
0.50
0.0197
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
MILLIMETERS
DIM MIN NOM MAX
A 0.80 0.95 1.10
A1 0.00 0.05 0.10
A3 0.20 REF
b 0.10 0.21 0.30
C 0.10 0.14 0.25
D 1.80 2.00 2.20
E 1.15 1.25 1.35
e 0.65 BSC
L 0.10 0.20 0.30
HE 2.00 2.10 2.20
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
INCHES
MIN NOM MAX
0.031 0.037 0.043
0.000 0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
0.65
0.025
0.40
0.0157
0.65
0.025
1.9
0.0748
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
5
NTJD4401N/D
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