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PDF NTJD2152P Data sheet ( Hoja de datos )

Número de pieza NTJD2152P
Descripción Trench Small Signal MOSFET
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No Preview Available ! NTJD2152P Hoja de datos, Descripción, Manual

NTJD2152P
Trench Small Signal
MOSFET
8 V, Dual PChannel, SC88
ESD Protection
Features
Leading –8 V Trench for Low RDS(ON) Performance
ESD Protected Gate
Small Footprint (2 x 2 mm)
Same Package as SC706
PbFree Packages are Available
Applications
Load Power switching
DCDC Conversion
LiIon Battery Charging Circuits
Cell Phones, Media Players, Digital Cameras, PDAs
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
Unit
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
Current
(Based on RqJA)
Power Dissipation
(Based on RqJA)
Continuous Drain
Current
(Based on RqJL)
Power Dissipation
(Based on RqJL)
Pulsed Drain Current
Steady
State
Steady
State
Steady
State
Steady
State
TA = 25 °C
TA = 85 °C
TA = 25 °C
TA = 85 °C
TA = 25 °C
TA = 85 °C
TA = 25 °C
TA = 85 °C
t 10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
PD
ID
PD
IDM
TJ,
TSTG
8.0 V
ww±w8.D.0ataSheet4UV.com
0.775 A
0.558
0.27 W
0.14
1.1 A
0.8
0.55 W
0.29
±1.2
55 to
150
A
°C
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IS 0.775 A
TL 260 °C
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Typ Max Unit
JunctiontoAmbient – Steady State
RqJA
400 460 °C/W
JunctiontoLead (Drain) – Steady State
RqJL
194 226
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 oz Cu area = 0.9523 in sq.
http://onsemi.com
V(BR)DSS
8 V
RDS(on) TYP
0.22 W @ 4.5 V
0.32 W @ 2.5 V
0.51 W @ 1.8 V
ID Max
0.775 A
SOT363
SC88 (6 LEADS)
S1 1
6 D1
G1 2
5 G2
D2 3
4 S2
Top View
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
1
SC88/SOT363
CASE 419B
STYLE 28
6
TA M G
G
1
S1 G1 D2
TA = Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
March, 2006 Rev. 3
1
Publication Order Number:
NTJD2152/D

1 page




NTJD2152P pdf
NTJD2152P
ORDERING INFORMATION
Device Order Number
Package Type
Tape and Reel Size
NTJD2152PT1
SOT363
3000 / Tape & Reel
NTJD2152PT1G
SOT363
(PbFree)
3000 / Tape & Reel
NTJD2152PT2
SOT363
3000 / Tape & Reel
NTJD2152PT2G
SOT363
(PbFree)
3000 / Tape & Reel
NTJD2152PT4
SOT363
10,000 / Tape & Reel
NTJD2152PT4G
SOT363
(PbFree)
10,000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifi-
cations Brochure, BRD8011/D.
http://onsemi.com
5

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