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PDF NCV33202 Data sheet ( Hoja de datos )
| Número de pieza | NCV33202 | |
| Descripción | (NCV33202 / NCV33204) Rail-to-Rail Operational Amplifiers | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de NCV33202 (archivo pdf) en la parte inferior de esta página. Total 17 Páginas | ||
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MC33201, MC33202,
MC33204, NCV33202,
NCV33204
Low Voltage, Rail-to-Rail
Operational Amplifiers
The MC33201/2/4 family of operational amplifiers provide
rail−to−rail operation on both the input and output. The inputs can be
driven as high as 200 mV beyond the supply rails without phase
reversal on the outputs, and the output can swing within 50 mV of each
rail. This rail−to−rail operation enables the user to make full use of the
supply voltage range available. It is designed to work at very low
supply voltages (± 0.9 V) yet can operate with a supply of up to +12 V
and ground. Output current boosting techniques provide a high output
current capability while keeping the drain current of the amplifier to a
minimum. Also, the combination of low noise and distortion with a
high slew rate and drive capability make this an ideal amplifier for
audio applications.
Features
• Low Voltage, Single Supply Operation
(+1.8 V and Ground to +12 V and Ground)
• Input Voltage Range Includes both Supply Rails
• Output Voltage Swings within 50 mV of both Rails
• No Phase Reversal on the Output for Over−driven Input Signals
• High Output Current (ISC = 80 mA, Typ)
• Low Supply Current (ID = 0.9 mA, Typ)
• 600 W Output Drive Capability
• Extended Operating Temperature Ranges
(−40° to +105°C and −55° to +125°C)
• Typical Gain Bandwidth Product = 2.2 MHz
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These are Pb−Free Devices
http://onsemi.com
8
1
8
1
8
1
PDIP−8
P, VP SUFFIX
CASE 626
SOIC−8
D, VD SUFFIX
CASE 751
Micro8]
DM SUFFIX
CASE 846A
14
1
14
1
PDIP−14
P, VP SUFFIX
CASE 646
SOIC−14
D, VD SUFFIX
CASE 751A
14
1
TSSOP−14
DTB SUFFIX
CASE 948G
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 11 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 17
1
Publication Order Number:
MC33201/D
1 page  
MC33201, MC33202, MC33204, NCV33202, NCV33204
2500
8 and 14 Pin DIP Pkg
2000
TSSOP-14 Pkg
1500
SO-14 Pkg
1000
SOIC-8
500 Pkg
0
- 55 - 40 - 25
0 25 50
85
TA, AMBIENT TEMPERATURE (°C)
Figure 2. Maximum Power Dissipation
versus Temperature
125
40
360 amplifiers tested from
35 3 (MC33204) wafer lots
30
VCC = + 5.0 V
VEE = Gnd
25
TA = 25°C
DIP Package
20
15
10
5.0
0
-10 - 8.0 - 6.0 - 4.0 - 2.0 0 2.0 4.0 6.0
VIO, INPUT OFFSET VOLTAGE (mV)
8.0
10
Figure 3. Input Offset Voltage Distribution
50
360 amplifiers tested from
3 (MC33204) wafer lots
40 VCC = + 5.0 V
VEE = Gnd
TA = 25°C
30 DIP Package
20
10
0
- 50 - 40 - 30 - 20 -10 0 10 20 30 40
TCVIO, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT (mV/°C)
50
Figure 4. Input Offset Voltage
Temperature Coefficient Distribution
200
VCC = + 5.0 V
VEE = Gnd
160
120 VCM = 0 V to 0.5 V
80
VCM > 1.0 V
40
0
- 55 - 40 - 25
0 25 70
85
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Input Bias Current
versus Temperature
125
150
100
50
0
- 50
-100
-150
- 200
- 250
0
VCC = 12 V
VEE = Gnd
TA = 25°C
2.0 4.0 6.0 8.0 10
VCM, INPUT COMMON MODE VOLTAGE (V)
12
Figure 6. Input Bias Current
versus Common Mode Voltage
300
260
220
180
VCC = + 5.0 V
140
VEE = Gnd
RL = 600 W
DVO = 0.5 V to 4.5 V
100
- 55 - 40 - 25
0 25 70
85
TA, AMBIENT TEMPERATURE (°C)
105 125
Figure 7. Open Loop Voltage Gain versus
Temperature
http://onsemi.com
5
5 Page 
MC33201, MC33202, MC33204, NCV33202, NCV33204
MARKING DIAGRAMS
SOIC−8
D SUFFIX
CASE 751
8
3320x
ALYW
G
1
SOIC−8
VD SUFFIX
CASE 751
8
320xV
ALYW
G
1
*
PDIP−8
P SUFFIX
CASE 626
8
MC3320xP
AWL
YYWWG
1
PDIP−8
VP SUFFIX
CASE 626
8
MC33202VP
AWL
YYWWG
1
SO−14
VD SUFFIX
CASE 751A
14
MC33204VDG *
AWLYWW
1
PDIP−14
P SUFFIX
CASE 646
14
MC33204P
AWLYYWWG
1
PDIP−14
VP SUFFIX
CASE 646
14
MC33204VP
AWLYYWWG
1
Micro−8
DM SUFFIX
CASE 846A
8
3202
AYWG
G
1
**
SO−14
D SUFFIX
CASE 751A
14
MC33204DG
AWLYWW
1
TSSOP−14
DTB SUFFIX
CASE 948G
14 14
MC33
204
ALYWG
G
MC33
204V
ALYWG
G
*
11
x = 1 or 2
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
G = Pb−Free Package
(Note: Microdot may be in either location)
*This marking diagram applies to NCV3320xV
**This marking diagram applies to NCV33202DMR2G
http://onsemi.com
11
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet NCV33202.PDF ] | |
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