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PDF NUP4004M5 Data sheet ( Hoja de datos )
| Número de pieza | NUP4004M5 | |
| Descripción | 5-Pin Bi-Directional Quad TVS Array | |
| Fabricantes | ON Semiconductor | |
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NUP4004M5
5−Pin Bi−Directional Quad
TVS Array
This 5−Pin bi−directional transient suppressor array is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in transient voltage and ESD sensitive equipment
such as computers, printers, cell phones, medical equipment, and other
applications. Its integrated design provides bi−directional protection
for four separate lines using a single TSOP−5 package. This device is
ideal for situations where board space is a premium.
http://onsemi.com
5
Features
• Bi−directional Protection for Four Lines in a Single TSOP−5 Package
• Low Leakage Current
• Low Capacitance
• Provides ESD Protection for JEDEC Standards JESD22
− Machine Model = Class C
− Human Body Model = Class 3B
• Provides ESD Protection for IEC 61000−4−2, 15 kV (Air),
8 kV (Contact)
• This is a Pb−Free Device
Mechanical Characteristics
• Void Free, Transfer−Molded, Thermosetting Plastic Case
www.DataSheet4U.com
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
Applications
• LCD, Plasma TV Video Lines
• Other Telephone Sets
• Computers / Printers / Set−Top Boxes
MAXIMUM RATINGS (TJ=25°C, unless otherwise specified)
Rating
Symbol Value Unit
Operating Junction Temperature Range
TJ −40 to °C
125
Storage Temperature Range
TSTG
−55 to °C
150
Lead Solder Temperature – Maximum (10 sec)
Human Body Model ( HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
TL
ESD
260 °C
16 kV
0.4
30
30
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
4
2
3
1
5
1
TSOP−5
CASE 483
MARKING
DIAGRAM
5
MY AYWG
G
1
MY = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUP4004M5T1G TSOP−5 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 0
1
Publication Order Number:
NUP4004M5/D
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet NUP4004M5.PDF ] | |
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