MBR120VLSFT1 Datasheet PDF - ON Semiconductor
| Part Number | MBR120VLSFT1 | |
| Description | Surface Mount Schottky Power Rectifier | |
| Manufacturers | ON Semiconductor | |
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MBR120VLSFT1
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
This device uses the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
Features
• Guardring for Stress Protection
• Optimized for Very Low Forward Voltage
• 125°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Package Designed for Optimal Automated Board Assembly
• ESD Ratings: Machine Model, C;
Human Body Model, 3B
• Pb−Free Packages are Available
Mechanical Characteristics
• Reel Options: MBR120VLSFT1 = 3,000 per 7″ reel/8 mm tape
MBR120VLSFT3 = 10,000 per 13″ reel/8 mm tape
• Device Marking: L2V
• Polarity Designator: Cathode Band
• Weight: 11.7 mg (approximately)
• Case: Epoxy, Molded
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2
1
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
20 VOLTS
SOD−123FL
CASE 498
PLASTIC
MARKING DIAGRAM
L2VMG
G
L2V = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MBR120VLSFT1 SOD−123FL 3000/Tape & Reel
MBR120VLSFT1G SOD−123FL 3000/Tape & Reel
(Pb−Free)
MBR120VLSFT3 SOD−123FL 10000/Tape & Reel
MBR120VLSFT3G SOD−123FL 10000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MBR120VLSFT1/D
|
| |
 
D
b
MBR120VLSFT1
PACKAGE DIMENSIONS
SOD−123LF
CASE 498−01
ISSUE A
E
q
POLARITY INDICATOR
OPTIONAL AS NEEDED
L
A1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT
SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM
FROM THE LEAD TIP.
MILLIMETERS
DIM MIN NOM MAX
A 0.90
0.95
1.00
A1 0.00
0.05
0.10
b 0.70 0.90 1.10
c 0.10 0.15 0.20
D 1.50
1.65
1.80
E 2.50
2.70
2.90
L 0.55 0.75 0.95
H E 3.40
q 0°
3.60
−
3.80
8°
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
HE
q
c
SOLDERING FOOTPRINT*
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
0.91
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ0.036
1.22
0.048
2.36
0.093
4.19 mm
0.165
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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| Information | Total 6 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ MBR120VLSFT1.PDF Datasheet ] | |
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