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PDF 3581 Data sheet ( Hoja de datos )

Número de pieza 3581
Descripción (3580 - 3582) HIGH VOLTAGE OPERATIONAL AMPLIFIERS
Fabricantes Burr-Brown 
Logotipo Burr-Brown Logotipo



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No Preview Available ! 3581 Hoja de datos, Descripción, Manual

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FEATURES
.HIGH OUTPUT SWINGS, up to j::145V (35821
.LARGE LOAD CURRENTS, up to j::6OmA (35801
.DIFFICUL T TO DAMAGE, automatic thermal shutoff
.REDUCES SOURCE LOADING, 1O11 n Input Z
.PRESERVES SYSTEM ACCURACY,
11OdB CM R 2OpA bias current
DESCRIPTION
The 3580 series is the first family of I ntegrated
Circuit operational amplifiers which will provide
output voltage swings of up to ::t 145V .
The monolithic F--ETinput stage has low bias currents
(20pA) which minimizes the offset voltages caused by
the bias current and the large resistance normally
associated with high voltage circuits.
The 3580 series is packaged in a TO-3 package which
will dissipate over 3W of power without a heat sink
and 4.5W with a suitable heat sink.
The input stage is protected against overvoltages and
the output stage is protected against short-circuits-
to-ground. A special thermal sensing circuit prevents
damage to the amplifier by automatically shutting
the amplifier down when too much power is being
dissipated.
SBOS166
International Airport Industrial Park -P .0. 8ox 11400 -Tucson. Arizona 85734 -Tel. [6021 746-1111 -Twx: 910-952.1111 .Cable. 88RCORP -Telex: 66-6491
@ 1975 Burr-Brown
Corporation
PDS-313D
Printed in U.S.A. May, 1987

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3581 pdf
www.ti.com
PACKAGE OPTION ADDENDUM
10-Mar-2006
PACKAGING INFORMATION
Orderable Device
3581J
Status (1)
NRND
Package
Type
TO-3
Package
Drawing
LMF
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
8 18 Pb-Free (RoHS Call TI N / A for Pkg Type
Exempt)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1

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