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PDF M58BW16F Data sheet ( Hoja de datos )
| Número de pieza | M58BW16F | |
| Descripción | (M58BW16F / M58BW32F) Flash memories | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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M58BW16F
M58BW32F
16 or 32 Mbit (x32, Boot Block, Burst)
3.3V supply Flash memories
Preliminary Data
Features
■ Supply voltage
– VDD = 2.7V to 3.6V (45ns) or
VDD = 2.5V to 3.3V (55ns)
– VDDQ = VDDQIN = 2.4V to 3.6V for I/O
Buffers
■ High performance
– Access times: 45 and 55ns
– Synchronous Burst Reads
– 75MHz Effective Zero Wait-State Burst
Read
– Asynchronous Page Reads
■ M58BW32F memory organization:
– Eight 64 Kbit small parameter blocks
– Four 128 Kbit large parameter blocks
– Sixty-two 512 Kbit main blocks
■ M58BW16F memory organization:
– Eight 64 Kbit parameter blocks
– Thirty-one 512 Kbit main blocks
■ Hardware block protection
– WP pin to protect any block combination
from Program and Erase operations
– PEN signal for Program/Erase Enable
■ Irreversible Modify protection (OTP like) on 128
Kbits:
– Block 1 (bottom device) or Block 72 (top
device) in the M58BW32F
– Blocks 2 & 3 (bottom device) or Blocks 36 &
35 (top device) in the M58BW16F
■ Security
– 64-bit Unique Device Identifier (UID)
■ Fast programming
– Write to Buffer and Program capability
■ Optimized for FDI drivers
– Common Flash Interface (CFI)
– Fast Program/Erase Suspend feature in
each block
PQFP80 (T)
BGA
LBGA80 (ZA)
10 x 8 ball array
■ Low power consumption
– 100µA typical Standby current
■ Electronic signature
– Manufacturer Code: 0020h
– Top Device Codes:
M58BW32FT: 8838h
M58BW16FT: 883Ah
– Bottom Device Codes:
M58BW32FB: 8837h
M58BW16FB: 8839h
■ Automotive Device Grade 3:
– Temperature: –40 to 125°C
– Automotive grade certified
November 2006
Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/81
www.st.com
1
1 page  
M58BW16F, M58BW32F
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
M58BW32F top boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
M58BW32F Bottom Boot Block Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
M58BW16F top boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
M58BW16F bottom boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Asynchronous bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Synchronous Burst Read bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Burst Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Burst type definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Read Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Program, Erase times and endurance cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Device capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Asynchronous Bus Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Asynchronous Page Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Asynchronous Write and Latch controlled Write AC characteristics . . . . . . . . . . . . . . . . . . 53
Synchronous Burst Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Reset, Power-Down and Power-up AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
LBGA80 10 × 12mm - 8 × 10 active ball array, 1mm pitch, package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
PQFP80 - 80 lead Plastic Quad Flat Pack, package mechanical data . . . . . . . . . . . . . . . . 63
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Query structure overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
CFI - Query address and data output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
CFI - Device voltage and timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
M58BW16F device geometry definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
M58BW16F extended query information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
M58BW32F device geometry definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
M58BW32F Extended query information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
5/81
5 Page 
M58BW16F, M58BW32F
Figure 2. LBGA connections (top view through package)
123456
Description
78
A A15 A14 VDD PEN VSS A6 A3 A2
B A16 A13 A12 A9 A8 A5 A4 A1
C A17 A18 A11 A10 NC A7 NC A0
A19/
D
DQ3
DQ0
NC(1)
NC
NC
DQ31
DQ30
DQ29
E
VDDQ
DQ4
DQ2
DQ1
DQ27
DQ28
DQ26
VDDQ
F
VSSQ
DQ7
DQ6
DQ5
NC
DQ25
DQ24
VSSQ
G
VDDQ
DQ8
DQ10
DQ9
DQ22
DQ21
DQ23
VDDQ
H
DQ13
DQ12
DQ11
WP
DQ17
DQ19
DQ18
DQ20
J
DQ15
DQ14
L
B
E
G
R DQ16
K VDDQIN
RP
K
VSS
VDD
W
GD NC
1. Ball D3 is NC in the M58BW16F and A19 in the M58BW32F.
AI12854b
11/81
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet M58BW16F.PDF ] | |
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