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PDF SBR2A30P1 Data sheet ( Hoja de datos )
| Número de pieza | SBR2A30P1 | |
| Descripción | Surface Mount Super Barrier Rectifier | |
| Fabricantes | Diodes | |
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Features
• Low Forward Voltage Drop
• Low Leakage Current
• Superior Reverse Avalanche Capability
• Excellent High Temperature Stability
• Patented Interlocking Clip Design for High Surge Current
Capacity
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 150ºC Operating Junction Temperature
• ±16KV ESD Protection (HBM, 3B)
• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
• Qualified to AEC-Q101 Standards for High Reliability
SBR2A30P1
2.0A SBR®
SURFACE MOUNT SUPER BARRIER RECTIFIER
PowerDI®123
Mechanical Data
• Case: PowerDI®123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Polarity Indicator: Cathode Band
• Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.018 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Symbol
VRRM
VRWM
VRM
VR(RMS)
IO
IFSM
Value
30
21
2.0
75
Thermal Characteristics
Characteristic
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Operating and Storage Temperature Range
Symbol
RθJS
RθJA
RθJA
TJ, TSTG
Value
5
175
100
-65 to +150
Notes:
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
Unit
V
V
A
A
Unit
ºC/W
ºC
SBR and PowerDI are registered trademarks of Diodes Incorporated.
SBR2A30P1
Document number: DS30920 Rev. 11 - 2
1 of 4
www.diodes.com
October 2008
© Diodes Incorporated
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| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet SBR2A30P1.PDF ] | |
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