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PDF ICS8534-01 Data sheet ( Hoja de datos )

Número de pieza ICS8534-01
Descripción LVPECL FANOUT BUFFER
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Integrated
Circuit
Systems, Inc.
ICS8534-01
LOW SKEW, 1-TO-22
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
GENERAL DESCRIPTION
ICS
The ICS8534-01 is a low skew, 1-to-22 Differen-
tial-to-3.3V LVPECL Fanout Buffer and a member
HiPerClockS™ of the HiPerClockS™Family of High Performance
Clock Solutions from ICS.The ICS8534-01 has two
selectable clock inputs. The CLK, nCLK pair can
accept most standard differential input levels.The PCLK, nPCLK
pair can accept LVPECL, CML, or SSTL input levels. The de-
vice is internally synchronized to eliminate runt pulses on the
outputs during asynchronous assertion/deassertion of the OE
pin. The ICS8534-01’s low output and part-to-part skew char-
acteristics make it ideal for workstation, server, and other high
performance clock distribution applications.
FEATURES
22 differential LVPECL outputs
Selectable differential CLK, nCLK or LVPECL clock inputs
CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
PCLK, nPCLK supports the following input types:
LVPECL, CML, SSTL
Maximum output frequency: 500MHz
Output skew: 100ps (maximum)
Translates any single-ended input signal (LVCMOS, LVTTL,
GTL) to LVPECL levels with resistor bias on nCLK input
Additive phase jitter, RMS: 0.04ps (typical)
3.3V supply mode
0°C to 85°C ambient operating temperature
BLOCK DIAGRAM
CLK_SEL
CLK
nCLK
PCLK
nPCLK
OE
0
1
LE
Q
D
PIN ASSIGNMENT
22 Q0:Q21
22 nQ0:nQ21
VCCO
nQ6
Q6
nQ5
Q5
nQ4
Q4
nQ3
Q3
nQ2
Q2
nQ1
Q1
nQ0
Q0
VCCO
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
49 32
50 31
51 30
52 29
53 28
54 27
55 26
56 ICS8534-01
57
25
24
58 23
59 22
60 21
61 20
62 19
63 18
64 17
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
VCCO
Q14
nQ14
Q15
nQ15
Q16
nQ16
Q17
nQ17
Q18
nQ18
Q19
nQ19
Q20
nQ20
VCCO
8534AY-01
64-Lead TQFP E-Pad
10mm x 10mm x 1.0mm package body
Y package
Top View
www.icst.com/products/hiperclocks.html
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REV. A NOVEMBER 19, 2004

1 page




ICS8534-01 pdf
Integrated
Circuit
Systems, Inc.
ICS8534-01
LOW SKEW, 1-TO-22
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
TABLE 4D. LVPECL DC CHARACTERISTICS, VCC = VCCO = 3.3V±5%, TA=0°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical
PCLK
IIH
Input High Current
nPCLK
VCC = VIN = 3.465V
V = V = 3.465V
CC IN
PCLK
IIL
Input Low Current
nPCLK
VCC = 3.465V, VIN = 0V
VCC = 3.465V, VIN = 0V
-5
-150
VPP Peak-to-Peak Input Voltage
0.3
VCMR
Common Mode Input Voltage; NOTE 1, 2
VEE + 1.5
VOH Output High Voltage; NOTE 3
VCC - 1.4
VOL Output Low Voltage; NOTE 3
VCC - 2.0
VSWING
Peak-to-Peak Output Voltage Swing
0.6
NOTE 1: Common mode voltage is defined as VIH.
NOTE 2: For single ended applications, the maximum input voltage for PCLK and nPCLK is VCC + 0.3V.
NOTE 3: Outputs terminated with 50to VCCO - 2V.
Maximum
150
5
1
VCC
VCC - 0.9
VCC -1.7
1.0
Units
µA
µA
µA
µA
V
V
V
V
V
TABLE 5. AC CHARACTERISTICS, VCC = VCCO = 3.3V±5%, TA=0°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical Maximum
fMAX
tPD
tsk(o)
Output Frequency
Propagation Delay; NOTE 1
Output Skew; NOTE 2, 5
f 500MHz
2.0
500
3.0
100
tsk(pp) Part-to-Part Skew; NOTE 3, 5
Buffer Additive Phase Jitter, RMS;
tjit
refer to Additive Phase Jitter section;
(12KHz to 20MHz)
NOTE 4
0.04
tR / tF
tS
tH
odc
Output Rise/Fall Time
Setup Time
Hold Time
Output Duty Cycle
20% to 80%
f 266MHz
266 < f 500MHz
200
1.0
0.5
48
46
All parameters measured at fMAX unless noted otherwise.
Special thermal considerations may be required. See Applications Section.
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltages
and with equal load conditions at the same temperature. Using the same type of inputs on each device,
the outputs are measured at the differential cross points.
NOTE 4: Driving only one input clock.
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.
700
700
52
54
Units
MHz
ns
ps
ps
ps
ps
ns
ns
%
%
8534AY-01
www.icst.com/products/hiperclocks.html
5
REV. A NOVEMBER 19, 2004

5 Page





ICS8534-01 arduino
Integrated
Circuit
Systems, Inc.
ICS8534-01
LOW SKEW, 1-TO-22
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
THERMAL RELEASE PATH
The exposed metal pad provides heat transfer from the device
to the P.C. board. The exposed metal pad is ground pad con-
nected to ground plane through thermal via. The exposed pad
on the device to the exposed metal pad on the PCB is con-
tacted through solder as shown in Figure 6. For further informa-
tion, please refer to the Application Note on Surface Mount As-
sembly of Amkor’s Thermally /Electrically Enhance Leadframe
Base Package, Amkor Technology.
SOLDER M ASK
SIGNAL
TRACE
EXPOSED PAD
SOLDER
SIGNAL
TRACE
GROUND PLANE
THERMAL VIA
Expose Metal Pad
(GROUND PAD)
FIGURE 6. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
8534AY-01
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REV. A NOVEMBER 19, 2004

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