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PDF NBB-310 Data sheet ( Hoja de datos )

Número de pieza NBB-310
Descripción CASCADABLE BROADBAND GaAs MMIC AMPLIFIER
Fabricantes RF Micro Devices 
Logotipo RF Micro Devices Logotipo



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Typical Applications
• Narrow and Broadband Commercial and
Military Radio Designs
• Linear and Saturated Amplifiers
NBB-310
CASCADABLE BROADBAND
GaAs MMIC AMPLIFIER DC TO 12GHz
• Gain Stage or Driver Amplifiers for
MWRadio/Optical Designs (PTP/PMP/
LMDS/UNII/VSAT/WLAN/Cellular/DWDM)
Product Description
The NBB-310 cascadable broadband InGaP/GaAs MMIC
amplifier is a low-cost, high-performance solution for gen-
eral purpose RF and microwave amplification needs. This
50gain block is based on a reliable HBT proprietary
MMIC design, providing unsurpassed performance for
small-signal applications. Designed with an external bias
resistor, the NBB-310 provides flexibility and stability. The
NBB-310 is packaged in a low-cost, surface-mount
ceramic package, providing ease of assembly for high-
volume tape-and-reel requirements. It is available in
either packaged or chip (NBB-310-D) form, where its gold
metallization is ideal for hybrid circuit designs.
45°
UNITS:
Inches
(mm)
0.040
(1.02)
0.070
(1.78)
0.020
0.200 sq.
(5.08)
0.055
(1.40)
0.005
(0.13)
Optimum Technology Matching® Applied
Si BJT
GaAs HBT
GaAs MESFET
Si Bi-CMOS
9InGaP/HBT
SiGe HBT
GaN HEMT
Si CMOS
SiGe Bi-CMOS
GND
4
MARKING - N6
Package Style: Micro-X, 4-Pin, Ceramic
Features
• Reliable, Low-Cost HBT Design
• 13dB Gain
• High P1dB of +15.2dBm at 6GHz
• Single Power Supply Operation
• 50I/O Matched for High Freq. Use
RF IN 1
3 RF OUT
2
GND
Functional Block Diagram
Rev A5 030912
Ordering Information
NBB-310
Cascadable Broadband GaAs MMIC Amplifier DC to
12 GHz
NBB-310-T1 or -T3Tape & Reel, 1000 or 3000 Pieces (respectively)
NBB-310-D
NBB-310 Chip Form (100 pieces minimum order)
NBB-310-E
Fully Assembled Evaluation Board
NBB-X-K1
Extended Frequency InGaP Amp Designer’s Tool Kit
RF Micro Devices, Inc.
Tel (336) 664 1233
7628 Thorndike Road
Fax (336) 664 0454
Greensboro, NC 27409, USA
http://www.rfmd.com
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NBB-310 pdf
NBB-310
Chip Outline Drawing - NBB-310-D
Chip Dimensions: 0.017” x 0.017” x 0.004”
UNITS:
Inches
(mm)
Back of chip is ground.
OUTPUT
INPUT
GND
VIA
0.017 ± 0.001
(0.44 ± 0.03)
0.017 ± 0.001
(0.44 ± 0.03)
0.004 ± 0.001
(0.10 ± 0.03)
Sales Criteria - Unpackaged Die
Die Sales Information
• All segmented die are sold 100% DC-tested. Testing parameters for wafer-level sales of die material shall be nego-
tiated on a case-by-case basis.
• Segmented die are selected for customer shipment in accordance with RFMD Document #6000152 - Die Product
Final Visual Inspection Criteria1.
• Segmented die has a minimum sales volume of 100 pieces per order. A maximum of 400 die per carrier is allow-
able.
Die Packaging
• All die are packaged in GelPak ESD protective containers with the following specification:
O.D.=2"X2", Capacity=400 Die (20X20 segments), Retention Level=High(X8).
• GelPak ESD protective containers are placed in a static shield bag. RFMD recommends that once the bag is
opened the GelPak/s should be stored in a controlled nitrogen environment. Do not press on the cover of a closed
GelPak, handle by the edges only. Do not vacuum seal bags containing GelPak containers.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit 2.
Package Storage
• Unit packages should be kept in a dry nitrogen environment for optimal assembly, performance, and reliability.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit2.
Die Handling
• Proper ESD precautions must be taken when handling die material.
• Die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of twee-
zers. Do not touch die with any part of the body.
• When using automated pick-up and placement equipment, ensure that force impact is set correctly. Excessive force
may damage GaAs devices.
Rev A5 030912
4-21

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