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PDF NUS2501W6 Data sheet ( Hoja de datos )

Número de pieza NUS2501W6
Descripción Integrated NPN Digital Transistor
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NUS2501W6
Integrated NPN Digital
Transistor with Switching
Diode Array
This new option of integrated devices is designed to replace a
discrete solution of a single transistor with three switching diodes.
BRT (Bias Resistor Transistor) contains a single transistor with a
monolithic bias network consisting of two resistors; a series base
resistor and a base−emitter resistor. The BRT technology eliminates
these individual components by integrating them into a single device,
therefore integration of a single BRT with three switching diodes
results in a significant reduction of both system cost and board space.
This new device is offered in the SC−88 surface mount package.
Features
Single SC−88 Surface Mount Package
Moisture Sensitivity Level 1
Benefits
Integration of Six Discrete Components
Integrated Solution Offers Cost and Space Savings
Integrated Solution Improves System Reliability
Applications
Wireless Phones
Handheld Products
Notebook Computers
LCD Display Panels
MAXIMUM RATINGS (TA = 25°C unless otherwise noted.)
Rating
Symbol
Value
Collector−Base Voltage
Collector−Emitter Voltage
Collector Current
Diode Reverse Voltage
Diode Peak Reverse Voltage
Diode Forward Current
Diode Peak Forward Current
VCBO
VCEO
IC
VR
VRM
IF
IFM
50
50
100
80
80
100
300
Unit
Vdc
Vdc
mAdc
Vdc
Vdc
mAdc
mAdc
http://onsemi.com
16
25
34
6
1
SC−88
(SOT−363)
CASE 419B
MARKING
DIAGRAM
6
LGd
1
LG = Specific Device Code
d = Date Code
ORDERING INFORMATION
Device
Package
Shipping
NUS2501W6T1
SC−88 3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
January, 2004 − Rev. P1
Publication Order Number:
NUS2501W6/D

1 page




NUS2501W6 pdf
NUS2501W6
PACKAGE DIMENSIONS
SC−88 (SOT−363)
CASE 419B−02
ISSUE T
A
G
654
S −B−
123
D 6 PL
0.2 (0.008) M B M
N
C
H
K
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
INCHES
DIM MIN MAX
A 0.071 0.087
B 0.045 0.053
C 0.031 0.043
D 0.004 0.012
G 0.026 BSC
H −−− 0.004
J 0.004 0.010
K 0.004 0.012
N 0.008 REF
S 0.079 0.087
MILLIMETERS
MIN MAX
1.80 2.20
1.15 1.35
0.80 1.10
0.10 0.30
0.65 BSC
−−− 0.10
0.10 0.25
0.10 0.30
0.20 REF
2.00 2.20
SOLDER FOOTPRINT*
2.4
0.094
1.9
0.074
0.7
0.028
0.95
0.037
0.95
0.037
1.0
0.039
ǒ ǓSCALE 10:1
mm
inches
*For information on soldering specifications, please refer to
our Soldering Reference Manual, SOLDERRM/D.
http://onsemi.com
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