NUP4103FC Datasheet PDF - ON Semiconductor
| Part Number | NUP4103FC | |
| Description | Four Channel ESD Array | |
| Manufacturers | ON Semiconductor | |
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NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
Features
• Unidirectional, Quad ESD Protection
• Ultra−small Flip−Chip Packaging (0.95 mm x 1.33 mm)
• Compliance with IEC61000−4−2 (Level 4) Requirements
• Maximum Leakage Current of 100 nA at 3.3 V
• Pb−Free Package is Available*
Benefits
• Protects Four Data Lines from ESD while Reducing Component
Count
• Small Package Saves on PCB Real Estate
• Provides Protection for ESD Industry Standards, IEC 61000,
HBM and MM
• Low Leakage Capability Minimizes Power Loss in the System
Applications
• ESD Protection for Portable Equipment
• Cell Phones
• MP3 Players
• PDAs
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
Machine Model
VPP kV
30
30
16
1.6
Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
TJ
TA
TSTG
150
−40 to +85
−55 to +150
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
CIRCUIT DESCRIPTION
A1 C1
B2
A3 C3
1
5−PIN FLIP−CHIP CSP
PLASTIC
CASE 766AB
MARKING
DIAGRAM
ÈÈ E M G
G
E = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
TOP VIEW
(Bumps Down)
1 23
A
BOTTOM VIEW
(Bumps Up)
3 21
A
BB
CC
ORDERING INFORMATION
Device
Package
Shipping†
NUP4103FCT1 Flip−Chip 3000/Tape & Reel
NUP4103FCT1G Flip−Chip 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
1
Publication Order Number:
NUP4103FC/D
|
| |
 
NUP4103FC
PACKAGE DIMENSIONS
4X
0.10 C
5−PIN FLIP−CHIP CSP
CASE 766AB−01
ISSUE O
D AB
TERMINAL A1
LOCATOR
È
E
0.10 C
A1
A2 A C
0.05 C
SEATING
PLANE
D1
f
1
5X b
2
0.05 C A B 3
0.03 C
AB
C
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A −−− 0.680
A1 0.210 0.270
A2 0.380 0.430
D 1.330 BSC
E 0.960 BSC
b 0.290 0.340
e 0.500 BSC
f 0.433 BSC
D1 0.866 BSC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NUP4013FC/D
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