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PDF NUF9001FC Data sheet ( Hoja de datos )
| Número de pieza | NUF9001FC | |
| Descripción | 10 Line EMI Filter | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NUF9001FC
10 Line EMI Filter
This device is a ten−line EMI filter array for wireless applications.
Greater than −35 dB attenuation is obtained at frequencies from
800 MHz to 3.0 GHz. ESD protection is provided across all
capacitors.
Features
• EMI Filtering and ESD Protection
• Integration of 30 Discretes
• Provides Protection for IEC61000−4−2 (Level 4)
♦ 8.0 kV (Contact)
• Flip−Chip Package
• Moisture Sensitivity Level 1
• ESD Rating: Machine Model = C; Human Body Model = 3B
• Pb−Free Package is Available*
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
• Integrated Solution Improves System Reliability
Applications
• EMI Filtering and ESD Protection for Data Lines
• Cell Phones
• Handheld Products
• MP3 Players
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
ESD Discharge
IEC61000−4−2
Contact Discharge
VPP
8.0 kV
Steady−State Power per Resistor
PR 100 mW
Steady−State Power per Package
PT 200 mW
Operating Temperature Range
TOP −40 to +85 °C
Storage Temperature Range
TSTG −55 to +150 °C
Junction Temperature
TJ
+125
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
INPUT
http://onsemi.com
LOW−PASS FILTER
OUTPUT
RI/O = 100 W
Cinput = 28 pF
ÇÇÇÇMARKING DIAGRAM
A1 Flip−Chip
NUF9001
AYWWG
CASE 499G
G
NUF9001 = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
(Ball Side)
1 234 5
E O1 O2 O3 O4 O5
D O6 O7 O8 O9 O10
C GND GND GND GND GND
B IN6 IN7 IN8 IN9 IN10
A IN1 IN2 IN3 IN4 IN5
ORDERING INFORMATION
Device
NUF9001FCT1
Package
Flip−Chip
Shipping†
3000 Tape & Reel
NUF9001FCT1G Flip−Chip 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 5
1
Publication Order Number:
NUF9001FC/D
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet NUF9001FC.PDF ] | |
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