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PDF NL7SZ19 Data sheet ( Hoja de datos )

Número de pieza NL7SZ19
Descripción 1-of-2 Decoder/ Demultiplexer
Fabricantes ON Semiconductor 
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NL7SZ19
1−of−2 Decoder/
Demultiplexer
The NL7SZ19 is a 1 of 2 decoder/demultiplexer that can operate
from 1.65 to 5.5 V. The device is fabricated in sub−micron CMOS for
high speed and fast decode times. Both inputs and outputs are in high
impedance state, when supply voltage is powered down. Both inputs
are tolerant of voltages up to 5.5 volts, regardless of operating voltage.
This device is suitable for low power decoding in a variety of
applications.
Features
High−Speed Propagation Delay
tPD 2.7 nS (Typ), Load 50 pF @ 5.0 V
32 mA Output Drive Capability @ 5.0 V
Power Down Impedance
Inputs/Outputs in High−Z
Broad VCC Operating Range
1.65 V to 5.5 V
Surface Mount Technology
SC−70, 6−Lead Packaging
OVT* on I/Os
Pb−Free Package is Available
Typical Applications
Cell Phones
PDAs
Digital Cameras
Video Cameras
Important Information
ESD Protection: HBM >2000 V
Latchup Max Rating: 300 mA
Pin to Pin Compatible with NC7SZ19
*Over Voltage Tolerance (OVT) enables input and output pins to function outside
(higher) of their operating voltages, with no damage to the devices or to signal
integrity.
http://onsemi.com
MARKING
DIAGRAM
66
1
SOT−363/SC70−6/SC−88
DF SUFFIX
CASE 419B
LE
d
LEd
1
= Device Marking
= Date Code
A1
6 Y0
GND 2
5 VCC
E3
(TOP VIEW)
4 Y1
PIN/FUNCTION TABLE
Pin Function
A Decoder Address/Demultiplexer Select
E Decoder Output Enable/Demultiplexer Data
Y0 Output 0
Y1 Output 1
TRUTH TABLE
EA
LL
LH
HX
X = Don’t Care
Y0 = A + E
L
H
H
Y1 = A + E
H
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
November, 2004 − Rev. 4
1
Publication Order Number:
NL7SZ19/D

1 page




NL7SZ19 pdf
NL7SZ19
PACKAGE DIMENSIONS
SOT−363/SC70−6/SC−88
DF SUFFIX
A 6−LEAD PACKAGE
CASE 419B−02
G ISSUE U
654
S −B−
123
D 6 PL
C
0.2 (0.008) M B M
N
J
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD
419B−02.
INCHES
DIM MIN MAX
A 0.071 0.087
B 0.045 0.053
C 0.031 0.043
D 0.004 0.012
G 0.026 BSC
H −−− 0.004
J 0.004 0.010
K 0.004 0.012
N 0.008 REF
S 0.079 0.087
MILLIMETERS
MIN MAX
1.80 2.20
1.15 1.35
0.80 1.10
0.10 0.30
0.65 BSC
−−− 0.10
0.10 0.25
0.10 0.30
0.20 REF
2.00 2.20
HK
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.40
0.0157
0.65
0.025
1.9
0.0748
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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