|
|
PDF EMIF04-10006F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF04-10006F2 | |
| Descripción | 4 LINES EMI ILTER AND ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de EMIF04-10006F2 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
|
No Preview Available !
www.DataSheet4U.com
®
IPAD™
EMIF04-10006F2
4 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS
Where EMI filtering in ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards
DESCRIPTION
The EMIF04-10006F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF04 flip-chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV. This device
includes four EMIF filters and 4 separated ESD
diodes.
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free package
■ Very low PCB space consuming:
2.92mm x 1.29mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
(IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration and wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2 level 4:
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3: 30kV
®
Flip-Chip
(15 Bumps)
Table 1: Order Code
Part Number
EMIF04-10006F2
Marking
FS
Figure 1: Pin Configuration (ball side)
987
654
32 1
D3 I4 I3 I2 I1 D1 A
Gnd
Gnd
Gnd
B
D4 O4 O3 O2 O1 D2 C
TM: IPAD is a trademark of STMicroelectronics.
September 2004
REV. 1
1/7
1 page  
EMIF04-10006F2
Figure 11: Order code
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 12: FLIP-CHIP Package Mechanical Data
500µm ± 50
250µm ± 50
315µm ± 50
650µm ± 65
2.92mm ± 50µm
Figure 13: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
Figure 14: Marking
Dot, ST logo
xx = marking
z = packaging
location
yww = datecode
(y = year
ww = week)
All dimensions in µm
545 400
E
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF04-10006F2.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| EMIF04-10006F1 | 4 LINES EMI FILTER AND ESD PROTECTION | ST Microelectronics |
| EMIF04-10006F2 | 4 LINES EMI ILTER AND ESD PROTECTION | ST Microelectronics |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |