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PDF TD62S050AFM Data sheet ( Hoja de datos )
| Número de pieza | TD62S050AFM | |
| Descripción | TD62S050AFM | |
| Fabricantes | Toshiba Semiconductor | |
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TD62S050AFM
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Collector-emitter voltage
Output withstand voltage
Output current
Input voltage
VCEO
VCE (SUS)
IOUT
VIN
50
50
500
-0.5~30
V
V
mA
V
Clamp diode reverse voltage
Clamp diode forward current
Power dissipation
VR
IF
PD (Note 4)
50
500
0.78
V
mA
W
Saturated thermal resistance
Rth (j-a)
(Note 4)
Rth (j-c)
(Note 5)
160
25
°C/W
Operating temperature
Storage temperature
Topr
-40~85
°C
Tstg
-55~150
°C
Note 4: 114.3 ´ 76.2 ´ 1.6 mm glass epoxy film substrate Cu heat dissipation pattern 100 mm2
Note 5: When an infinite heat sink is mounted.
Recommended Operating Condition (Ta = -40~85°C)
Characteristics
Output withstand voltage
Output current
Input voltage
Input voltage
Output ON
Output OFF
Clamp diode reverse voltage
Clamp diode forward current
Symbol
Test Condition
VCEO
IOUT
VIN
VIN (ON)
VIN (OFF)
VR
IF
¾
Ta = 60°C, Tj = 105°C
¾
IOUT = 400 mA, hFE = 800
¾
¾
¾
Min Typ. Max Unit
0 ¾ 50 V
¾ ¾ 220 mA
0 ¾ 24 V
2.8 ¾ 24
0 ¾ 0.7
V
¾ ¾ 50 V
¾ ¾ 350 mA
Electrical Characteristics (Ta = 25°C)
Characteristics
Output leakage current
Output saturation voltage
DC current amplification ratio
Input current
Output ON
Input voltage
Output ON
Output ON
Clamp diode leakage current
Clamp diode forward voltage
Turn-on delay
Turn-off delay
Symbol
Test
Circuit
Test Condition
Min Typ. Max Unit
ICEX
1 VCE = 50 V, VIN = OPEN
¾ ¾ 10 mA
VCE (sat)
IOUT = 300 mA, IIN = 500 mA
2
IOUT = 200 mA, IIN = 350 mA
¾ 1.1 1.3
V
¾ 1.0 1.2
hFE
2 VCE = 2.0 V, IOUT = 350 mA
1000 ¾
¾
IIN (ON)
3 VIN = 2.4 V, IOUT = 350 mA
¾ 0.4 0.7 mA
VIN (ON)
4
VCE = 2 V,
hFE = 800
IOUT = 350 mA
IOUT = 200 mA
¾
¾
¾ 2.6
¾ 2.2
V
IR 5 VR = 50 V
¾ ¾ 10 mA
VF 6 IF = 350 mA
¾ 1.6 2.0 V
tON
tOFF
7
VOUT = 50 V, RL = 125 W,
CL = 15 pF
¾ 0.02 ¾
¾ 1.0 ¾
ms
2 2001-12-05
1 page  
TD62S050AFM
RESTRICTIONS ON PRODUCT USE
000707EBA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
6 2001-12-05
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