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PDF MAAPGM0046-DIE Data sheet ( Hoja de datos )
| Número de pieza | MAAPGM0046-DIE | |
| Descripción | Power Amplifier | |
| Fabricantes | Tyco Electronics | |
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RO-P-DS-3066 - -
400mW Ku-Band Power Amplifier
15.5-18.0 GHz
Preliminary Information
Features
♦ 400 mW Saturated Output Power Level
♦ 15.5-18.0 GHz Operation
♦ Variable Drain Voltage (4-10V) Operation
♦ Self-Aligned MSAG® MESFET Process
15.5-18.0 GHz GaAs MMIC Amplifier
Primary Applications
♦ Point-to-Point Communications
♦ Ku Satellite Communications
Description
The MAAPGM0046-Die is a 3-stage 400mW power amplifier with on-
chip bias networks. This product is fully matched to 50 ohms on both
the input and output. It can be used as a power amplifier stage or as
a driver stage in high power applications.
Each device is 100% RF tested on wafer to ensure performance
compliance. The part is fabricated using M/A-COM’s repeatable,
high performance and highly reliable GaAs Multifunction Self-Aligned
Gate (MSAG®) MESFET Process. This process provides polyimide
scratch protection.
Electrical Characteristics: TB = 40°C1, Z0 = 50Ω, VDD = 8V, VGG = -1.8V, Pin = 12 dBm
Parameter
Bandwidth
Output Power
Power Added Efficiency
Symbol
f
POUT
PAE
Typical
15.5 -18.0
26
11
Units
GHz
dBm
%
1-dB Compression Point
P1dB
25
dBm
Small Signal Gain
G 16
dB
Input VSWR
VSWR
3:1
Output VSWR
VSWR
2:1
Gate Current
Drain Current
Output Third Order Intercept
IGG
IDD
OTOI
<2
< 600
32
mA
mA
dBm
Noise Figure
NF 8
dB
3rd Order Intermodulation Distortion,
Single Carrier Level = 18 dBm
5th Order Intermodulation Distortion,
Single Carrier Level = 18 dBm
IM3
IM5
34
47
dBc
dBc
1. TB = MMIC Base Temperature
1 page  
400mW Ku-Band Power Amplifier
RO-P-DS-3066 - - 5/6
MAAPGM0046-DIE
Mechanical Information
Chip Size: 3.000 x 1.824 x 0.075 mm (118 x 72 x 3 mils)
1.66mm.
0.86mm.
IN
GND:G
GND:G
VDD
GND:G
GND: G
GND:G
GND:G
1.82mm.
OUT 0.86mm.
0.16mm.
0
GND:G
GND:G
0
VGG
GND:G
GND:G
Figure 5. Die Layout
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Pad
RF: IN, OUT
DC: VDD
DC: VGG
Size (µm)
100 x 200
200 x 150
150 x 150
Size (mils)
4x8
8x6
6x6
Specifications subject to change without notice.
Email: [email protected]
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
5 Page | ||
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| PDF Descargar | [ Datasheet MAAPGM0046-DIE.PDF ] | |
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