|
|
PDF MAAPGM0038 Data sheet ( Hoja de datos )
| Número de pieza | MAAPGM0038 | |
| Descripción | Power Amplifier | |
| Fabricantes | Tyco Electronics | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de MAAPGM0038 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
|
No Preview Available !
www.DataSheet4U.com
1.2W Power Amplifier 9.0-12.0 GHZ
MAAPGM0038
RO-P-DS-3060 E
Features
♦ Variable Drain Voltage (4-10V) Operation
♦ MSAG™ Process
♦ High Performance Ceramic Bolt Down Package
Primary Applications
♦ Point-to-Point Radio
♦ Weather Radar
♦ Airborne Radar
APGM0038
YWWXXX
Description
The MAAPGM0038 is a packaged, 3-stage, 1.2 W power
amplifier with on-chip bias networks in a bolt down ceramic
package, allowing easy assembly. This product is fully
matched to 50 ohms on both the input and output. It can be
used as a power amplifier stage or as a driver stage in high
power applications.
Fabricated using M/A-COM’s repeatable, high performance
and highly reliable GaAs Multifunction Self-Aligned Gate
MESFET Process, each device is 100% RF tested on wafer to
ensure performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like
manufacturing processes, planar processing of ion
implanted transistors, multiple implant capability enabling
power, low-noise, switch and digital FETs on a single chip,
and polyimide scratch protection for ease of use with
automated manufacturing processes. The use of refractory
metals and the absence of platinum in the gate metal
formulation prevents hydrogen poisoning when employed in
hermetic packaging.
Pin Number
1
2
3
4
5
6
7
8
9
10
RF Designator
No Connection
VGG
RF IN
VGG
No Connection
No Connection
VDD
RF OUT
VDD
No Connection
Maximum Operating Conditions 1
Parameter
Symbol
Absolute Maximum
Units
Input Power
Drain Supply Voltage
Gate Supply Voltage
Quiescent Drain Current (No RF, 40% IDSS)
Quiescent DC Power Dissipated (No RF)
PIN
VDD
VGG
IDQ
PDISS
Junction Temperature
Storage Temperature
Processing Temperature
TJ
TSTG
1. Operation outside of these ranges may reduce product reliability.
21.0
+12.0
-3.0
1.15
7.5
180
-55 to +150
230
dBm
V
V
A
W
°C
°C
°C
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1 page  
1.2W Power Amplifier 9.0-12.0 GHZ
Figure 6. Recommended Bias Configuration
RG
(See Electrical Characteristics - Page 2)
VGG
0.1 µF
100 pF
RFIN
MAAPGM0038
RO-P-DS-3060 E
100 pF
RFOUT
0.1 µF
VDD
100 pF
100 pF
Pin Number
1
2
3
4
5
6
7
8
9
10
RF Designator
No Connection
VGG
RF IN
VGG
No Connection
No Connection
VDD
RF OUT
VDD
No Connection
Assembly Instructions:
This flange mount style package provides a robust interface between a highly integrated GaAs MMIC device and a circuit board
which may be assembled using conventional surface mount techniques. A thin shim made of a thermally and electrically
conductive, ductile material should be used prior to installation of the CR-15 to improve the thermal and electrical performance of
the package to housing interface. Refer to M/A-COM Application Note #M567* for more information .
For applications where surface mount components are to be installed after the CR-15 installation, this package will not be
damaged when subjected to typical convection or IR oven reflow profiles. Refer to M/A-COM Application Note #M538* for
maximum allowable reflow time and temperature. Alternatively, the package leads may be individually soldered. Whether an iron
or hot gas soldering equipment is used, care should be taken to insure that the temperature is well controlled and electric static
discharge (ESD) safe.
* Application Notes can be found by going to the Site Search Page on M/A-COM’s web page
(http://www.macom.com/search/search.jsp) and searching for the required Application Note.
Biasing Notes:
♦ The 100pF bypass capacitors must be placed as close to the VGG and VDD pins as possible
(recommended < 100 mils).
♦ A negative bias must be applied to VGG before applying a positive bias to VDD to prevent damage to the amplifier.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet MAAPGM0038.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MAAPGM0030 | Power Amplifier | Tyco Electronics |
| MAAPGM0030-DIE | Power Amplifier | Tyco Electronics |
| MAAPGM0034 | Power Amplifier | Tyco Electronics |
| MAAPGM0034-DIE | X/Ku-Band Power Amplifier | Tyco Electronics |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |