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PDF ECP050D Data sheet ( Hoja de datos )

Número de pieza ECP050D
Descripción High Linearity InGaP HBT Amplifier
Fabricantes WJ Communication 
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ECP050D
½ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
Product Features
x 1800 – 2300 MHz
x +28.5 dBm P1dB
x +44 dBm Output IP3
x 14 dB Gain @ 1960 MHz
x +5V Single Positive Supply
x 16-pin 4x4mm lead-free/green/
RoHS-compliant QFN Package
Applications
x Final stage amplifiers for Repeaters
x Mobile Infrastructure
Product Description
Functional Diagram
The ECP050D is a high dynamic range driver amplifier
in a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance for various
narrowband-tuned application circuits with up to +44
dBm OIP3 and +28.5 dBm of compressed 1dB power. It
is housed in an industry standard in a lead-free/
green/RoHS-compliant 16-pin 4x4mm QFN surface-
mount package. All devices are 100% RF and DC tested.
Vref 1
N/C 2
RF IN 3
N/C 4
16 15 14
567
13
12 N/C
11 RF OUT
10 RF OUT
9 N/C
8
The ECP050D is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECP050D to maintain high linearity over temperature and
operate directly off a single +5V supply. This
combination makes the device an excellent candidate for
transceiver line cards in current and next generation
multi-carrier 3G base stations.
Function
Vref
RF Input
RF Output
Vbias
GND
N/C or GND
Pin No.
1
3
10, 11
16
Backside Paddle
2, 4-9, 12-15
Specifications (1)
Typical Performance (4)
Parameters
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
IS-95A Channel Power
@ -45 dBc ACPR, 1960 MHz
wCDMA Channel Power
@ -45 dBc ACLR, 2140 MHz
Noise Figure
Operating Current Range (3)
Device Voltage
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
Min
1800
12.5
+26.5
+41
dBm
dB
mA 200
V
Typ
2140
14.4
23
8
+28.5
+42
+22.5
+20
5.3
250
+5
Max
2300
300
1. Test conditions unless otherwise noted. 25 ºC, Vsupply = +5 V in tuned application circuit.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. This corresponds to the quiescent current or operating current under small-signal conditions. It is
expected that the current can increase up to 300mA at P1dB.
Parameters
Frequency
Gain
S11
S22
Output P1dB
Output IP3 (2)
IS-95A Channel Power
@ -45 dBc ACPR,
wCDMA Channel Power
@ -45 dBc ACLR
Noise Figure
Supply Bias
Units
MHz
dB
dB
dB
dBm
dBm
dBm
dBm
dB
Typical
1960
2140
14.3 14.4
-12 -23
-8 -8
+28.3
+28.5
+44 +42
+22.5
+20
5 5.3
+5 V @ 250 mA
4. Typical parameters reflect performance in a tuned application circuit at +25 ¡ C.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
Junction Temperature
Rating
-40 to +85 qC
-65 to +150 qC
+22 dBm
+8 V
400 mA
2W
+250 qC
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No.
ECP050D-G
ECP050D-PCB1960
ECP050D-PCB2140
Description
½ Watt, High Linearity InGaP HBT Amplifier
(lead-free/green/RoHS-compliant 16-pin 4x4mm QFN package)
1960 MHz Evaluation Board
2140 MHz Evaluation Board
Specifications and information are subject to change without notice
WJ Communications, Inc   Phone 1-800-WJ1-4401   FAX: 408-577-6621   e-mail: [email protected]   Web site: www.wj.com
Page 1 of 5 April 2006

1 page




ECP050D pdf
ECP050D
½ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
ECP050D-G Mechanical Information
This package is lead-free/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Outline Drawing
Product Marking
The component will be marked with an
“E050G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E050” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 1 at +260 ¨ C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted
device is recommended for proper thermal operation.
2. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25
mm (.010” ).
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85 qC
Thermal Resistance, Rth (1)
62 qC / W
Junction Temperature, Tj (2)
162 qC
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 § C. Tjc is a function of the voltage at pins 10 and 11 and
the current applied to pins 10, 11, and 16 and can be calculated by:
Tj = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85
§ C case temperature. A minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 § C.
1000000
MTTF vs. GND Tab Temperature
100000
10000
1000
100
50
60 70 80 90
Tab Temperature (°C )
100
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
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