DataSheet.es    


PDF HY29DS163 Data sheet ( Hoja de datos )

Número de pieza HY29DS163
Descripción (HY29DS162 / HY29DS163) Simultaneous Read/Write Flash Memory
Fabricantes Hynix Semiconductor 
Logotipo Hynix Semiconductor Logotipo



Hay una vista previa y un enlace de descarga de HY29DS163 (archivo pdf) en la parte inferior de esta página.


Total 30 Páginas

No Preview Available ! HY29DS163 Hoja de datos, Descripción, Manual

www.DataSheet4U.com
HY29DS162/HY29DS163
16 Megabit (2M x 8/1M x 16) Super-Low Voltage,
Dual Bank, Simultaneous Read/Write, Flash Memory
KEY FEATURES
n Single Power Supply Operation
Read, program, and erase operations
from 1.8 to 2.2 V (2.0V ± 10%)
Ideal for battery-powered applications
n Simultaneous Read/Write Operations
Host system can program or erase in one
bank while simultaneously reading from any
sector in the other bank with zero latency
between read and write operations
n High Performance
120 and 130 ns access time versions with
± 10% power supply and 30pF load
n Ultra Low Power Consumption (Typical
Values)
Automatic sleep mode current: 200 nA
Standby mode current: 200 nA
Read current: 5 mA (at 5 MHz)
Program/erase current: 15 mA
n Boot-Block Sector Architecture with 39
Sectors in Two Banks for Fast In-System
Code Changes
n Secured Sector: An Extra 64 Kbyte Sector
that Can Be:
Factory locked and identifiable: 16 bytes
available for a secure, random factory-
programmed Electronic Serial Number
Customer lockable: Can be read, program-
med, or erased just like other sectors
n Flexible Sector Architecture
Sector Protection allows locking of a
sector or sectors to prevent program or
erase operations within that sector
Temporary Sector Unprotect allows
changes in locked sectors (requires high
voltage on RESET# pin)
n Automatic Erase Algorithm Erases Any
Combination of Sectors or the Entire Chip
n Automatic Program Algorithm Writes and
Verifies Data at Specified Addresses
n Compliant with Common Flash Memory
Interface (CFI) Specification
n Minimum 100,000 Write Cycles per Sector
(1,000,000 cycles Typical)
n Compatible with JEDEC Standards
Pinout and software compatible with
single-power supply Flash devices
Superior inadvertent write protection
n Data# Polling and Toggle Bits
Provide software confirmation of completion
of program or erase operations
n Ready/Busy# Pin
Provides hardware confirmation of
completion of program or erase operations
n Erase Suspend
Suspends an erase operation to allow
programming data to or reading data from
a sector in the same bank
Erase Resume can then be invoked to
complete the suspended erasure
n Hardware Reset Pin (RESET#) Resets the
Device to Reading Array Data
n WP#/ACC Input Pin
Write protect (WP#) function allows
hardware protection of two outermost boot
sectors, regardless of sector protect status
Acceleration (ACC) function provides
accelerated program times
n Fast Program and Erase Times
Sector erase time: 1 sec typical
Byte/Word program time utilizing
Acceleration function: 13 µs typical
n Space Efficient Packaging
48-pin TSOP and 48-ball FBGA packages
LOGIC DIAGRAM
20
A[19:0]
DQ[7:0]
CE#
OE#
WE#
RESET#
BYTE#
DQ[14:8]
DQ[15]/A[-1]
WP#/ACC
RY/BY#
8
7
Preliminary
Revision 1.3, April 2001

1 page




HY29DS163 pdf
HY29DS162/HY29DS163
SIGNAL DESCRIPTIONS
Name
Type
Description
A[19:0]
Inputs
Address, active High. In word mode, these 20 inputs select one of 1,048,576
(1M) words within the array for read or write operations. In byte mode, these
inputs are combined with the DQ[15]/A[-1] input (LSB) to select one of 2,097,152
(2M) bytes within the array for read or write operations.
DQ[15]/A[-1],
DQ[14:0]
Data Bus, active High. In word mode, these pins provide a 16-bit data path
Inputs/Outputs for read and write operations. In byte mode, DQ[7:0] provide an 8-bit data path
Tri-state and DQ[15]/A[-1] is used as the LSB of the 21-bit byte address input. DQ[14:8]
are unused and remain tri-stated in byte mode.
BYTE#
Input
Byte Mode, active Low. Controls the Byte/Word configuration of the device.
Low selects Byte mode, High selects Word mode.
Chip Enable, active Low. This input must be asserted to read data from or
CE#
Input
write data to the HY29DS16x. When High, the data bus is tri-stated and the
device is placed in the Standby mode.
OE#
Input
Output Enable, active Low. This input must be asserted for read operations
and negated for write operations. BYTE# determines whether a byte or a word
is read during the read operation. When High, data outputs from the device are
disabled and the data bus pins are placed in the high impedance state.
WE#
Input
Write Enable, active Low. Controls writing of command sequences in order to
program data or erase sectors of the memory array. A write operation takes
place when WE# is asserted while CE# is Low and OE# is High. BYTE#
determines whether a byte or a word is written during the write operation.
RESET#
Input
Hardware Reset, active Low. Provides a hardware method of resetting the
HY29DS16x to the read array state. When the device is reset, it immediately
terminates any operation in progress. The data bus is tri-stated and all read/write
commands are ignored while the input is asserted. While RESET# is asserted,
the device will be in the Standby mode.
RY/BY#
Output
Open Drain
Ready/Busy Status. Indicates whether a write or erase command is in
progress or has been completed. Valid after the rising edge of the final WE#
pulse of a command sequence. It remains Low while the device is actively
programming data or erasing, and goes High when it is ready to read array data.
Write Protect, active Low/Accelerate (VHH).
Write Protect Function: Placing this pin at VIL disables program and erase
operations in two of the eight 8 Kbyte/4 Kword boot sectors. The affected
sectors are S0 and S1 in a bottom-boot device, or S37 and S38 in a top-boot
device. If the pin is placed at VIH, the protection state of those two sectors
reverts to whether they were last set to be protected or unprotected using the
method described in the Sector Group Protection and Unprotection sections.
WP#/ACC
Input
Accelerate Function: If VHH is applied to this input, the device enters the Unlock
Bypass mode, temporarily unprotects any protected sectors, and uses the
higher voltage on the pin to reduce the time required for program operations.
The system would then use the two-cycle program command sequence as
required by the Unlock Bypass mode. Removing VHH from the pin returns the
device to normal operation.
This pin must not be at VHH for operations other than accelerated programming,
or device damage may result. Leaving the pin unconnected may result in
inconsistent device operation.
VCC -- 2-volt (nominal) power supply.
VSS -- Power and signal ground.
r1.3/Apr 01
5

5 Page





HY29DS163 arduino
The HY29DS16x is automatically set for reading
array data after device power-up and after a hard-
ware reset to ensure that no spurious alteration of
the memory content occurs during the power tran-
sition. No command is necessary in this mode to
obtain array data, and both banks of the device
remain enabled for read accesses until the com-
mand register contents are altered.
This device features the capability of reading data
from one bank of the memory while a program or
erase operation is in progress in the other bank.
If the host reads from an address within an eras-
ing or erase-suspended sector, or from a bank
where a programming operation is taking place,
the device outputs status data instead of array data
(see Write Operation Status section). After com-
pleting an Automatic Program or Automatic Erase
algorithm within a bank, that bank automatically
returns to the read array data mode.
When the host issues an Erase Suspend com-
mand, the bank specified in the command enters
the Erase- Suspended Read mode. While in that
mode, the host can read data from, or program
data into, any sector in that bank except the
sector(s) being erased. After completing a pro-
gramming operation in the Erase Suspend mode,
the system may once again read array data with
the same exception noted above.
The host must issue a hardware reset or the soft-
ware reset command to return a sector to the read
array data mode if DQ[5] goes high during a pro-
gram or erase cycle, or to return the device to the
read array data mode while it is in the Electronic
ID mode.
Write Operation
Certain operations, including programming data
and erasing sectors of memory, require the host
to write a command or command sequence to the
HY29DS16x. Writes to the device are performed
by placing the byte or word address on the devices
address inputs while the data to be written is input
on DQ[15:0] (BYTE# = High) or DQ[7:0] (BYTE#
= Low). The host system must drive the CE# and
WE# pins Low and drive OE# High for a valid write
operation to take place. All addresses are latched
on the falling edge of WE# or CE#, whichever
happens later. All data is latched on the rising
edge of WE# or CE#, whichever happens first.
HY29DS162/HY29DS163
The Device Commandssection of this data sheet
provides details on the specific device commands
implemented in the HY29DS16x.
Accelerated Program Operation
This device offers improved performance for pro-
gramming operations through the Accelerate
(ACC)function. This is one of two functions pro-
vided by the WP#/ACC pin and is intended prima-
rily to allow faster manufacturing throughput at the
factory.
If VHH is applied to this input, the device enters the
Unlock Bypass mode, temporarily unprotects any
protected sectors, and uses the higher voltage on
the pin to reduce the time required for program
operations. The host system would then use the
two-cycle program command sequence as re-
quired by the Unlock Bypass mode. Removing
VHH from the pin returns the device to normal op-
eration.
This pin must not be at VHH for operations other
than accelerated programming, or device damage
may result. Leaving the pin floating or uncon-
nected may result in inconsistent device opera-
tion.
Write Protect Function
The Write Protect function provides a hardware
method of protecting certain boot sectors without
using VID. This is the second function provided by
the WP#/ACC pin.
Placing this pin at VIL disables program and erase
operations in two of the eight 8 Kbyte (4 Kword)
boot sectors. The affected sectors are sectors S0
and S1 in a bottom-boot device, or S37 and S38
in a top-boot device. If the pin is placed at VIH, the
protection state of those two sectors reverts to
whether they were last set to be protected or un-
protected using the method described in the Sec-
tor Group Protection and Unprotection sections.
Standby Operation
When the system is not reading or writing to the
device, it can place the device in the Standby
mode. In this mode, current consumption is greatly
reduced, and the data bus outputs are placed in
the high impedance state, independent of the OE#
input. The Standby mode can invoked using two
methods.
r1.3/Apr 01
11

11 Page







PáginasTotal 30 Páginas
PDF Descargar[ Datasheet HY29DS163.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
HY29DS162(HY29DS162 / HY29DS163) Simultaneous Read/Write Flash MemoryHynix Semiconductor
Hynix Semiconductor
HY29DS163(HY29DS162 / HY29DS163) Simultaneous Read/Write Flash MemoryHynix Semiconductor
Hynix Semiconductor

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar