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PDF CAT3612 Data sheet ( Hoja de datos )
| Número de pieza | CAT3612 | |
| Descripción | Programmable 300mA Camera Flash LED Driver | |
| Fabricantes | Catalyst Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CAT3612 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
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CAT3612
Programmable 300mA Camera Flash LED Driver
FEATURES
Dual matched regulated LED channels
300mA output current (150mA per channel)
1-wire EZDimTM Programmable LED Current
32 accurate dimming levels
Power efficiency up to 90%
Fractional pump 1x/1.5x
Low noise input ripple
Fixed High Frequency Operation 1MHz
“Zero” Current Shutdown Mode
Soft start and current limiting
Short circuit protection
Thermal shutdown protection
12-lead TDFN 3mm x 3mm package
APPLICATION
Camera Flash
Cellular Phones
Digital Still Cameras
ORDERING INFORMATION
Part Number
Package Quantity Package
per Reel Marking
CAT3612HV2-T2 TDFN-12 3x3 2000
Green *
HAAD
Note *: Plated lead finish is Matte Tin.
For other lead finish option, please contact factory.
PIN CONFIGURATION
Top View
PRODUCT DESCRIPTION
The CAT3612 is a high-efficiency 1x/1.5x fractional
charge pump with programmable current in two LED
channels. Each channel delivers accurate regulated
current up to 150mA and make CAT3612 ideal for
driving one or two flash LEDs.
Low noise operation is achieved by operating at a
constant switching frequency of 1MHz which allows
the use of small external ceramic capacitors. The
1x/1.5x fractional charge pump supports a wide
range of input voltages from 3V to 5.5V with
efficiency up to 90%, and is ideal for Li-Ion battery
powered devices.
The EN/DIM logic input provides a 1-wire EZDimTM
interface for dimming control of the LEDs. When
enabled, pulsing the EN/DIM reduces the LED
current on each negative edge in 31 linear steps
from 150mA down to zero current.
The device is available in the tiny 12-lead thin DFN
3mm x 3mm package with a max height of 0.8mm.
TYPICAL APPLICATION CIRCUIT
12-lead TDFN 3mm x 3mm
© 2006 Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
Note: Unused LED channel must be connected to VOUT
1 Doc. No. 5016 Rev. A
1 page  
www.DataSheet4U.com
CAT3612
TYPICAL CHARACTERISTICS
VIN = 3.6V, IOUT = 100mA, CIN = COUT = 2.2µF, C1 = C2 = 1µF, TAMB = 25°C unless otherwise specified.
LED Current Change vs. Input Voltage
5.0
4.0
3.0
2.0
1.0 1x Mode
0.0
-1.0
-2.0 1.5x Mode
-3.0
-4.0
-5.0
3.0 3.2 3.4 3.6 3.8 4.0
INPUT VOLTAGE [V]
4.2
LED Current Change vs. Temperature
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
-2.0
-3.0
-4.0
-5.0
-40
0 40 80
TEMPERATURE [°C]
120
Oscillator Frequency vs. Input Voltage
1.3
1.2
1.1
1.0
0.9
0.8
0.7
3.0
3.2 3.4 3.6 3.8
INPUT VOLTAGE [V]
4.0
Oscillator Frequency vs. Temperature
1.3
1.2
1.1
1.0
0.9
0.8
0.7
-40
0 40 80
TEMPERATURE [°C]
120
Output Resistance vs. Input Voltage (1x mode)
1.0
0.8
0.6
0.4
0.2
0.0
3.0
3.2 3.4 3.6 3.8 4.0
INPUT VOLTAGE [V]
4.2
Output Resistance vs. Input Voltage(1.5x mode)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
3.0
3.2 3.4 3.6 3.8 4.0
INPUT VOLTAGE [V]
4.2
© 2006 Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
5
Doc. No. 5016 Rev. A
5 Page 
www.DataSheet4U.com
CAT3612
Protection mode
If an LED becomes open-circuit, the output voltage
VOUT is internally limited to about 5.5V. This is to
prevent the output pin from exceeding its absolute
maximum rating.
The driver enters a thermal shutdown mode as soon
as the die temperature exceeds about +165ºC. When
the device temperature drops down by about 20ºC,
the device resumes normal operation.
External components
The driver requires a total of four external 1µF
ceramic capacitors: two for decoupling input and
output, and two for the charge pump. Both capacitor
types X5R and X7R are recommended for the LED
driver application. In the 1.5x charge pump mode, the
input current ripple is kept very low by design, and an
input bypass capacitor of 1µF is sufficient. In 1x mode,
the device operating in linear mode does not introduce
switching noise back onto the supply.
Recommended Layout
In 1.5x charge pump mode, the driver switches
internally at a high frequency of 1MHz. It is
recommended to minimize trace length to all four
capacitors. A ground plane should cover the area
under the driver IC as well as the bypass capacitors.
Short connection to ground on capacitors Cin and
Cout can be implemented with the use of multiple via.
A copper area matching the TDFN exposed pad
(GND) must be connected to the ground plane
underneath. The use of multiple via improves the
package heat dissipation.
Figure 5. Recommended Layout
© 2006 Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
11
Doc. No. 5016 Rev. A
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet CAT3612.PDF ] | |
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