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PDF BCM61B Data sheet ( Hoja de datos )
| Número de pieza | BCM61B | |
| Descripción | NPN/NPN matched double transistor | |
| Fabricantes | NXP Semiconductors | |
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BCM61B
NPN/NPN matched double transistor
Rev. 02 — 28 August 2009
Product data sheet
1. Product profile
1.1 General description
NPN/NPN matched double transistor in a SOT143B small Surface-Mounted Device (SMD)
plastic package. Matched version of BCV61.
PNP/PNP equivalent: BCM62B
1.2 Features
I Current gain matching
1.3 Applications
I Current mirror
I Differential amplifier
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter
Per transistor TR1
VCEO
hFE
collector-emitter voltage
DC current gain
Per transistor
IC collector current
Per device
IC1/IE2
current matching
Conditions
open base
VCE = 5 V;
IC = 2 mA
VCE1 = 5 V;
IE2 = −0.5 mA;
Tamb ≤ 25 °C
Min Typ Max Unit
- - 45 V
200 290 450
- - 100 mA
[1] 0.92 1.02 1.12
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
1 page  
NXP Semiconductors
BCM61B
NPN/NPN matched double transistor
Table 7. Characteristics …continued
Tamb = 25 °C unless otherwise specified
Symbol Parameter
Conditions
Per transistor TR2
VEBS
emitter-base voltage
Per device
VCB = 0 V;
IE = −250 mA
VCB = 0 V;
IE = −10 µA
IC1/IE2
current matching
VCE1 = 5 V;
IE2 = −0.5 mA;
Tamb ≤ 25 °C
VCE1 = 5 V;
IE2 = −0.5 mA;
Tamb ≤ 150 °C
VCE1 = 3 V;
IE2 = −0.5 mA;
Tamb ≤ 25 °C
VCE1 = 1 V;
IE2 = −0.5 mA;
Tamb ≤ 25 °C
Min Typ Max
--
−400 -
−1.8
-
[3] 0.92 1.02 1.12
[3] 0.93 -
1.13
[3] 0.91 1.01 1.11
[3] 0.9
1
1.1
[1] VBEsat decreases by about 1.7 mV/K with increasing temperature.
[2] VBE decreases by about 2 mV/K with increasing temperature.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Unit
V
mV
BCM61B_2
Product data sheet
Rev. 02 — 28 August 2009
© NXP B.V. 2009. All rights reserved.
5 of 13
5 Page 
NXP Semiconductors
BCM61B
NPN/NPN matched double transistor
12. Revision history
Table 9. Revision history
Document ID
Release date Data sheet status
Change notice Supersedes
BCM61B_2
Modifications:
20090828
Product data sheet
-
BCM61B_1
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
• Figure 13 “Wave soldering footprint SOT143B”: updated
BCM61B_1
20060919
Product data sheet
-
-
BCM61B_2
Product data sheet
Rev. 02 — 28 August 2009
© NXP B.V. 2009. All rights reserved.
11 of 13
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| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet BCM61B.PDF ] | |
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