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Diodes Incorporated - SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

Numéro de référence DFLS140L
Description SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Fabricant Diodes Incorporated 
Logo Diodes Incorporated 





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SPICE MODEL: DFLS140L
DFLS140L
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
· Guard Ring Die Construction for Transient Protection
· Low Power Loss, High Efficiency
· High Surge Capability
· High Current Capability and Low Forward Voltage Drop
· Lead Free Finish, RoHS Compliant (Note 4)
· "Green" Molding Compound (No Br, Sb)
· Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
· Case: PowerDIä123
· Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
· Moisture Sensitivity: Level 1 per J-STD-020C
· Terminal Connections: Cathode Band
· Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208 e3
· Marking & Type Code Information: See Page 3
· Weight: 0.096 grams (approx.)
· Ordering Information: See Last Page
D
A
B
C
L L1
E L2
L4 L3
A
H
E
Maximum Ratings @ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current @ TT = 120°C
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Operating Temperature Range
Storage Temperature Range
Symbol
VRRM
VRWM
VR
VR(RMS)
IF(AV)
IFSM
Tj
TSTG
Value
40
28
1.0
50
-55 to +125
-55 to +150
PowerDIä123
Dim Min Max Typ
A 3.65 3.75 3.70
B 2.775 2.825 2.80
C 1.750 1.800 1.775
D 0.955 1.000 0.98
E 0.95 1.05 1.00
H 0.15 0.25 0.20
L 0.60 0.70 0.65
L1 — — 1.36
L2 — — 1.10
L3 — — 0.20
L4 0.95 1.25 1.05
All Dimensions in mm
Unit
V
V
A
A
°C
°C
Thermal Characteristics @ TA = 25°C unless otherwise specified
Characteristic
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Symbol
PD
PD
RqJA
RqJA
RqJS
Value
1.67
556
60
180
10
Notes:
1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.
3. Theoretical RqJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
Unit
W
mW
°C/W
°C/W
°C/W
DS30490 Rev. 2 - 2
PowerDI is a trademark of Diodes Incorporated.
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