PDF IDT72T20118 Data sheet ( Hoja de datos )

Número de pieza	IDT72T20118
Descripción	(IDT72T20xxx) DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATION
Fabricantes	Integrated Device Technology
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No Preview Available ! www.DataSheet4U.com 2.5 VOLT HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATION 32,768 x 20/65,536 x 10, 65,536 x 20/131,072 x 10 131,072 x 20/262,144 x 10, 262,144 x 20/524,288 x 10 IDT72T2098, IDT72T20108 IDT72T20118, IDT72T20128 FEATURES: • Choose among the following memory organizations: IDT72T2098  32,768 x 20/65,536 x 10 IDT72T20108  65,536 x 20/131,072 x 10 IDT72T20118  131,072 x 20/262,144 x 10 IDT72T20128  262,144 x 20/524,288 x 10 • Up to 250MHz Operation of Clocks - 4ns read/write cycle time, 3.2ns access time • Users selectable input port to output port data rates, 500Mb/s Data Rate -DDR to DDR -DDR to SDR -SDR to DDR -SDR to SDR • User selectable HSTL or LVTTL I/Os • Read Enable & Read Clock Echo outputs aid high speed operation • 2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage • 3.3V Input tolerant • Mark & Retransmit, resets read pointer to user marked position • Write Chip Select (WCS) input enables/disables Write Operations • Read Chip Select (RCS) synchronous to RCLK • Programmable Almost-Empty and Almost-Full flags, each flag can default to one of four preselected offsets • Dedicated serial clock input for serial programming of flag offsets • User selectable input and output port bus sizing -x20 in to x20 out -x20 in to x10 out -x10 in to x20 out -x10 in to x10 out • Auto power down minimizes standby power consumption • Master Reset clears entire FIFO • Partial Reset clears data, but retains programmable settings • Empty and Full flags signal FIFO status • Select IDT Standard timing (using EF and FF flags) or First Word Fall Through timing (using OR and IR flags) • Output enable puts data outputs into High-Impedance state • JTAG port, provided for Boundary Scan function • 208 Ball Grid array (PBGA), 17mm x 17mm, 1mm pitch • Easily expandable in depth and width • Independent Read and Write Clocks (permit reading and writing simultaneously) • High-performance submicron CMOS technology • Industrial temperature range (-40°C to +85°C) is available FUNCTIONAL BLOCK DIAGRAM WEN WCLK D0 -Dn (x20, x10) SREN SEN SCLK WCS WSDR INPUT REGISTER OFFSET REGISTER SI SO WRITE CONTROL LOGIC WRITE POINTER RAM ARRAY 32,768 x 20 or 65,536 x 10 65,536 x 20 or 131,072 x 10 131,072 x 20 or 262,144 x 10 262,144 x 20 or 524,288 x 10 FLAG LOGIC READ POINTER FF/IR PAF EF/OR PAE FWFT FSEL0 FSEL1 IW OW MRS PRS TCK TRST TMS TDO TDI BUS CONFIGURATION RESET LOGIC JTAG CONTROL (BOUNDARY SCAN) OUTPUT REGISTER READ CONTROL LOGIC Vref HSTL HSTL I/0 CONTROL OE Q0 -Qn (x20, x10) EREN ERCLK IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync is a trademark of Integrated Device Technology, Inc. COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 1  2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. RT MARK RSDR RCLK REN RCS 5996 drw01 DECEMBER 2003 DSC-5996/8 1 page IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS 32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10 PARTIAL RESET (PRS) MASTER RESET (MRS) COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES WRITE CLOCK (WCLK) WRITE ENABLE (WEN) WRITE CHIP SELECT (WCS) WRITE SINGLE DATA RATE (WSDR) (x20, x10) DATA IN (D0 - Dn) SERIAL CLOCK (SCLK) SERIAL ENABLE(SEN) SERIAL READ ENABLE(SREN) FIRST WORD FALL THROUGH (FWFT) SERIAL INPUT (SI) SERIAL OUTPUT (SO) FULL FLAG/INPUT READY (FF/IR) PROGRAMMABLE ALMOST-FULL (PAF) IDT 72T2098 72T20108 72T20118 72T20128 READ CLOCK (RCLK) READ ENABLE (REN) OUTPUT ENABLE (OE) READ CHIP SELECT (RCS) READ SINGLE DATA RATE (RSDR) (x20, x10) DATA OUT (Q0 - Qn) RCLK ECHO (ERCLK) REN ECHO (EREN) MARK RETRANSMIT (RT) EMPTY FLAG/OUTPUT READY (EF/OR) PROGRAMMABLE ALMOST-EMPTY (PAE) INPUT WIDTH (IW) OUTPUT WIDTH (OW) 5996 drw03 Figure 1. Single Device Configuration Signal Flow Diagram TABLE 1 — BUS-MATCHING CONFIGURATION MODES I W OW Write Port Width L L x20 L H x20 H L x10 H H x10 NOTE: 1. Pin status during Master Reset. Read Port Width x20 x10 x20 x10 TABLE 2 — DATA RATE-MATCHING CONFIGURATION MODES WSDR RSDR Write Port Width Read Port Width HH HL LH LL NOTE: 1. Pin status during Master Reset. 2. Data Rate Matching can be used in conjunction with Bus-Matching modes. Double Data Rate Double Data Rate Single Data Rate Single Data Rate Double Data Rate Single Data Rate Double Data Rate Single Data Rate 5 5 Page IDT72T2098/108/118/128 2.5V HIGH-SPEED TeraSync™ DDR/SDR FIFO 20-BIT/10-BIT CONFIGURATIONS 32K x 20/64K x 10, 64K x 20/128K x 10, 128K x 20/256K x 10, 256K x 20/512K x 10 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES HSTL 1.5V AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels 0.25 to 1.25V 0.4ns 0.75 VDDQ/2 NOTE: 1. VDDQ = 1.5V±. AC TEST LOADS VDDQ/2 50Ω I/O Z0 = 50Ω 5996 drw04 Figure 2a. AC Test Load EXTENDED HSTL 1.8V AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels 0.4 to 1.4V 0.4ns 0.9 VDDQ/2 NOTE: 1. VDDQ = 1.8V±. 2.5V LVTTL 2.5V AC TEST CONDITIONS Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels GND to 2.5V 1ns VCC/2 VDDQ/2 NOTE: 1. For LVTTL VCC = VDDQ. 6 5 4 3 2 1 20 30 50 80 100 Capacitance (pF) 200 5996 drw04a Figure 2b. Lumped Capacitive Load, Typical Derating 11 11 Page

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