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NCP1526 fiches techniques PDF

ON Semiconductor - Step Down Converter

Numéro de référence NCP1526
Description Step Down Converter
Fabricant ON Semiconductor 
Logo ON Semiconductor 





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NCP1526 fiche technique
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NCP1526
400 mA, 1.2 V,
High−Efficiency, Step−Down
Converter with Low Noise
Voltage Regulator
Optimized for RF Module
The NCP1526 product is a monolithic integrated circuit combining
stepdown PWM DCDC converter dedicated to the portable
applications powered from one cell Liion or three cell Alkaline/
NiCd/NiMH batteries and a low noise output voltage regulator
dedicated to supply RF sensitive module in the portable applications.
The DCDC converter operates with a fixed output voltage of
1.2 V and delivers up to 400 mA. It uses synchronous rectification to
increase efficiency and reduces external part count. The device also
has a builtin 3.0 MHz (nominal) oscillator which reduces
component size by allowing small inductor and capacitors. It
includes an integrated softstart, cyclebycycle current limiting,
and thermal shutdown protection.
The additional 2.80 V very low noise, low drop output regulator, is
available with 150 mA current capability, current limitation and
overtemperature protection.
Finally, the NCP1526 is available in a space saving, ultra low
profile 3x3 mm 10 pin UDFN package (thickness 0.55 mm max).
Features
StepDown Converter
Up to 85% Efficiency
Output Current Capability 400 mA
3.0 MHz Switching Frequency
1.2 V Fixed Output Voltage
Synchronous Rectification for Higher Efficiency
LDO Regulator
2.80 V Output Voltage
Up to 150 mA Output Current Capability
Very Low Noise: 45 mVRMS
All Pins are Fully ESD Protected
2.7 V to 5.5 V Input Voltage Range
Thermal Limit Protection
3.0 mm x 3.0 mm x 0.55 mm UDFN Package
This is a PbFree Device
Typical Applications
Cellular Phones, Smart Phones and PDAs
Digital Still Cameras
MP3 Players and Portable Audio Systems
Wireless and DSL Modems
Portable Equipment
http://onsemi.com
MARKING
DIAGRAM
10 PIN DFN
MU SUFFIX
CASE 506AT
1526
ALYWG
G
1526
A
L
Y
W
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= PbFree Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
FB
EN1
EN2
GND2
BYPASS
(Top View)
VIN1
LX
GND1
VIN2
V1
ORDERING INFORMATION
Device
Package
Shipping
NCP1526MUTXG
UDFN10 3000/Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
July, 2006 Rev. 0
1
Publication Order Number:
NCP1526/D

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